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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
PCB design is an important step before PCB production. If not designed well, it will directly affect the performance and quality of the circuit board, causing the entire circuit board to be scrapped; Layout of components is an important aspect of PCB design. So, what are the requirements for PCB design and layout of components? 1. Aesthetics When designing a PCB, it is not only important to consider the orderly placement of components, but also to consider the graceful and smooth wiring. 2. Force The circuit board should be able to withstand various external forces and vibrations during installation and operation: it should have a reasonable shape, and the positions of various holes on the board should be arranged reasonably; Generally, the distance between the hole and the board edge should be at least greater than the diameter of the hole; It should also be noted that the weakest section of the plate caused by irregular holes should also have sufficient bending strength. 3.
1. Judging the strength level of circuit board manufacturers: Effective PCB sampling before production can also provide a clear understanding of the strength of circuit board manufacturers, especially those who have not cooperated with them before. By sampling, the strength level of circuit board manufacturers in production can be determined. Only circuit board manufacturers with comparable capabilities and the ability to process circuit boards that meet standard technical requirements can be determined, To better meet the requirements of long-term cooperation and high-quality processing and production of PCB boards. 2. Reduce the defect rate in batch production of PCB circuit boards: The processing and production volume of PCB boards are relatively large. In order to ensure smooth mass production without quality problems and reduce defect rates, it is very necessary to conduct circuit board sampling processing before production. The processing of PCB boards requires complex proce
1: When adjusting the mold, please try to use the operation manual instead of relying solely on intuition for operation; 2: Before drilling, check whether the clutch, brake, slider and other parts are normal, whether the operating mechanism is reliable, and confirm all data before performing drilling operations; 3: Several sets of pressure plates and T-head pressure plate screws should be prepared for use corresponding to the mold. The front end of the pressure plate should not contact the straight wall of the lower mold. A piece of sand cloth should be placed between each contact surface, and the screws must be tightened; 4: In order to improve the punching performance of the substrate, the paper substrate should be preheated, with a preferred temperature of 70-90 ℃; 5: Select a punch (including model and tonnage) based on the calculated punching pressure, mold size, and closing height according to the mold design; 6: The gasket under the mold is usually 2 pieces, which must
1. Good basic quality/good application effect: The performance of the beloved multi-layer circuit board in terms of basic quality is reassuring, and the direct manifestation is that the electronic products made from it, such as electronic watches, computers, military equipment, etc., are in excellent use. The multi-layer circuit board can excellently complete the interconnection between various electrical components, The quality and texture of high-quality multi-layer boards are evident in various application environments. 2. Outstanding quality/high durability: Users have also found that good multi-layer circuit boards exhibit extremely strong durability, which means they exhibit strong adaptability in various places, including sports facilities. The performance durability and vibration resistance of multi-layer circuit boards are very reassuring. The manufacturing capacity of multi-layer circuit boards is also constantly optimized with the continuous innovation of technology.
The process of processing PCB multilayer boards is very complex, as it is in the process of laminated boards. The total thickness and number of layers of PCB multilayer boards are limited by the characteristics of the PCB board, and the variety of boards with different thicknesses that special boards can provide is generally limited. Therefore, designers must consider the characteristics of the board and the limitations of the PCB multilayer board processing technology in the PCB multilayer board design process Processing PCB multi-layer board lamination refers to the process of bonding each layer of circuit board into a whole. The process includes: kiss pressing, full pressing, and cold pressing (to quickly cool the circuit board and maintain size stability). During the kiss pressing stage, resin infiltrates the bonding surface and fills the gaps in the circuit, and then enters full pressing to bond all the gaps. The first thing to pay attention to when laminating PCB multilayer b
1. Design PCB, create punching files, lay copper plates on both sides of the PCB, then polish the copper plates on both sides for CNC drilling, and inspect for defects after polishing and drying. 2. Main process through hole: To complete the hole, the hole should be sorted and standardized. After confirming that there are no defects in the hole through water washing, drying, and other procedures, black holes should be made to prepare for copper plating through the hole. Next, through holes should be drilled and dried (to ensure sufficient black space, water washing and drying should be performed twice). After completion, copper plating can be carried out. After copper plating, polishing should be carried out, and the hole should be checked again for defects. 3. Production process: apply photosensitive blue oil - dry ink - apply bottom and top line film, and position properly - expose and develop appropriately - wash and dry with water - check for defects in the circuit - tin plat
1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc. 2. Power supply equipment: switch regulators, DC/AC converters, SW regulators, etc. 3. Communication electronic equipment: high-frequency amplifier, filtering device, and transmitting circuit. 4. Office automation equipment: electric motor drivers, etc. 5. Automobile: electronic regulators, igniters, power controllers, etc. 6. Computer: CPU board, floppy disk drive, power supply device, etc. 7. Power module: inverter, solid-state relay, rectifier bridge, etc.
a) Ma Keng: Ma Keng is the result of organic pollution. A large pit usually indicates oil pollution. If the stirring is poor, the bubbles cannot be expelled, which will form pits. Wetting agents can be used to reduce its impact. We usually refer to small pitting as pinholes. Poor pre-treatment, metallic impurities, low boric acid content, and low plating temperature can all cause pinholes. Maintenance and process control of the plating solution are crucial, and anti pinhole agents should be used as process stabilizers to supplement. b) Roughness and burrs: Roughness indicates that the solution is dirty, which can be corrected by sufficient filtration (high pH can easily form hydroxide precipitates and should be controlled). If the current density is too high, impurities are brought in by impure anode mud and added water, and in severe cases, roughness and burrs will be produced. c) Low adhesion: If the copper coating is not fully oxidized, the coating will peel off and the adhesi
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