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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
Computer -assisted manufacturing (CAM) is processed according to the final process. The requirements of the process mentioned earlier must make necessary preparations before light painting. For example, the problems of mirroring, welding expansion, craft lines, craft frames, line width adjustment, central holes, and appearance lines must be completed in the CAM process. In particular, it is important to note that there must be a corresponding process in the intermediate distance between the user file and must be processed accordingly. Because the process and technical level of each factory are different, to meet the ultimate requirements of the user, the necessary adjustments must be made in the production process to meet the requirements of the user's relevant accuracy. Therefore, CAM processing is an indispensable process in the manufacturing of modern printing circuits. ① Fix the size of the pad, combat D code. ② Correct the width of the line, combat D code. ③ Check the mini
1. Several temperature parameters in temperature and layer pressure are more important. That is, the melting temperature of the resin, the curing temperature of the resin, the temperature of the heat disk setting, the actual temperature of the material, and the speed of the heating. The resin starts to melt when the temperature of the melting temperature rises to 70 ° C. It is precisely because of the further increase of temperature that resin is further melted and flows. During the period of temperature of 70-140 ° C, resin is easy to fluid. It is precisely because of the popularity of the resin that it ensures that the resin fills and humidity. As the temperature gradually increases, the liquidity of the resin has gone through a small change from small to large, then small, and finally when the temperature reaches 160-170 ° C, the fluidity of the resin is 0. At this time, the temperature is called the curing temperature. In order to enable the resin to fill the glue and humidity
When the multi -layer layer is pressed, the inner core plate is required. The treatment process of the inner plate has black oxidation treatment and brown treatment process. The oxidation treatment process is to form a black oxide film on the inner copper foil, and the thickness of the black oxide film is 0.25-4). 50mg / cm2. The brown treatment process (horizontal brownization) forms a layer of organic membrane on the inner copper foil. The inner plate processing process is: 1. Increase the surface of the inner copper foil and resin to enhance the combination between the two. 2. Increase the effective and moistness of copper foil when the melting resin flows, so that the flowing resin has sufficient ability to extend the oxidation film, and show a strong grip after solidification. 3. Stop the impact of the decomposition of anemia in the liquid resin at high temperature at high temperature. 4. Make multi -layer boards improve acid resistance and prevent pink circle in the wet p
PCB line board price analysis PCB price consists of the following factors: 1. The materials used in PCB line boards are different Taking ordinary double panels as an example, plate materials generally include FR-4, CEM-3, etc., the thickness of the board ranges from 0.6mm to 3.0mm, and the copper thickness is different from ½OZ to 3 OZ. In terms of welding ink, there is a certain price difference in ordinary thermal solid oil and light sensitive green oil. 2. PCB uses different production processes Different production processes will cause different costs. For example, the gold -plated board and tin spray plate, making the gong (milling) board and beer (punch) board, the use of silk print lines and dry membrane lines will form different costs. Third, the PCB line board itself is difficult to be different Even if the materials are the same and the craftsmanship, the difficulty of PCB itself will cause different costs. For example, there are 1,000 holes on both line boards, and
PCB copper -covering board grade division 1. FR-4 A1 Copper Copy Copper Board This class is mainly used in electronic products such as military industry, communication, computers, digital circuits, industrial instruments, automotive circuits and other electronic products. The quality of this series of products has completely reached the world -class level, and it is the company with the highest grade and best performance. 2. FR-4 A2 Copper Cover Copper Plate. This level is mainly used for ordinary computers, instrumentations, senior home appliances and general electronic products. This series of copper -covering plates are widely used, and various performance indicators can meet the needs of general industrial electronic products. There is a good price performance ratio. Can enable customers to effectively improve price competitiveness. 3. FR-4 A3 Copper Crystal Copper Copper is a FR-4 product developed and produced for the company's home appliance industry, computer peripheral pr
PCB mechanical network printing common failure and cause countermeasures 1) There is a gap in the mouth of the scraper -grill. 2) The stress of the scraper is too small -increase the scraper pressure. 3) The distance between the network version and the printed board is too large -adjusting the network distance. 4) The raising of the mesh box causes uneven pressure of scraping -to change the net frame, re -stretch the net, and the network version. 5) The printing of the printing is too large -the preparation of the printing and the use of stability after the deployment. 6) The mask of the network version is too thick, through the small printing volume, and the net printing wire is too thin -the net version of the net must control the thickness of the mask (direct method). 7) The speed of the net printing is too fast -properly adjust the speed of the net printing. 8) Select improper printing and the number of silk nets is too high -replacement of the printing, and select the si
PCB osmotic ink 1) The mouth of the scraper becomes round -grinding scraper mouth. 2) The angle of the scraper network is too small -properly adjust the angle of the large scraper net. 3) The viscosity of the printing is too low -the exchanges with a large viscosity. 4) Poor solvents and printed mixing -fully stir up the printing before the net printing. 5) Wipe the network version with the solvent. After the solvent is not completely volatilized, the net prints -after the scrubbing version, the net printing after the solvent is volatilized. 6) The number of silk networks is too low -the Silk net version of the high net is used.
The flying needle tester does not depend on the insert pattern installed on a fixture or bracket. Based on this system, two or more probes are installed on the x-y plane that can be moved freely on the small magnetic head, and the test point is CADI GERBER data is directly controlled. The dual probe can move within the range of 4mil. The probe can move independently and does not really limit their degree of approaching each other. Tester with two back -and -forth arm -shaped objects is based on the measurement of capacitors. Press the circuit board on the insulating layer on a metal plate as another metal board of the capacitor. If there is a short circuit between the lines, the capacitor will be larger than a certain point. If there is-bargaining, the capacitance will become smaller. Test speed is an important criterion for choosing a tester. The needle bed tester can accurately test thousands of test points at one time, and the flying needle tester can only test two or four tes
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