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Multilayer PCB (Printed Circuit Board) occupies an important position in modern electronic technology. A multi-layer PCB is a circuit board composed of multiple conductive and insulating layers alternately stacked. Typically, a multi-layer PCB can contain three to ten or even more conductive layers. This structural design provides higher integration and more complex circuit layout possibilities for electronic devices. Firstly, multi-layer PCB has excellent space utilization. On a limited circuit board area, multi-layer design can accommodate more electronic components and circuit wiring. This is crucial for modern miniaturized and high-performance electronic devices. For example, in mobile devices such as smartphones and tablets, multi-layer PCBs can tightly integrate numerous chips, sensors, and other electronic components together, achieving lightweight and high-performance devices. Secondly, multi-layer PCB can provide better electrical performance. Due to the insulation laye
Classified by the upstream and downstream of the industry chain, it can be divided into raw materials - copper-clad laminates - printed circuit boards - electronic product applications. Its relationship is simply expressed as follows: Foslite Electronics Industry Chain Fiberglass Cloth: Fiberglass cloth is one of the raw materials for copper-clad laminates, woven from fiberglass yarn, accounting for about 40% (thick plate) and 25% (thin plate) of the cost of copper-clad laminates. Fiberglass yarn is made by calcining raw materials such as silica sand into a liquid state in a kiln, pulling them into extremely fine glass fibers through extremely small alloy nozzles, and then twisting hundreds of glass fibers into fiberglass yarn. The construction investment of kilns is huge, usually requiring hundreds of millions of funds, and once ignited, it must be produced continuously for 24 hours, with huge entry and exit costs. Fiberglass cloth manufacturing is similar to weaving enterprises,
Single sided PCB circuit board, also known as single panel, is a common type of printed circuit board. A single-sided PCB circuit board typically consists of a substrate and a layer of copper foil. The substrate generally uses insulating materials such as glass fiber reinforced epoxy resin to provide support and insulation for the circuit. Copper foil is used to form circuit patterns through etching and other processes, achieving connections between electronic components. The production of single panels is relatively simple and cost-effective. In terms of design, since only one side can be wired, the circuit layout needs to be more carefully planned. Usually, components are concentrated on one side, while the other side is mainly used for welding. This layout makes single panels widely used in some simple electronic devices, such as small appliances, toys, and simple electronic instruments. One of the advantages of single-sided PCB circuit boards is their ease of production and
The PCB production process mainly includes steps such as design, graphic conversion, plate making, etching, drilling, coating, soldering, testing, and cleaning. design phase The design phase is the starting point of PCB production, where CAD software is used to design circuit schematics and PCB layouts, determining information such as PCB board dimensions, wiring methods, and pad sizes. Graphic Conversion Stage After the design is completed, it is necessary to convert the circuit schematic and PCB layout into Gerber files for plate making and etching processes. Plate making stage Plate making is the core process in PCB production, which involves converting Gerber files into photoresist film, and then transferring the photoresist film pattern onto copper foil through exposure, development, and other processes to create the circuit and graphics of the PCB board. Etching stage Etching is the process of removing unwanted copper foil parts by immersing the plated copper foil in
After the entire circuit board design is completed, the PCB circuit board needs to be SMT mounted with components. Each SMT processing factory will determine the most suitable size for the circuit board according to the processing requirements of the assembly line. For example, if the size is too small or too large, the fixtures that fix the circuit board on the assembly line cannot be fixed. So the question is, what if the size of our circuit board itself is smaller than the size specified by the factory? That means we need to assemble the circuit boards together, combining multiple circuit boards into a single piece. Splicing can significantly improve efficiency for both high-speed surface mount machines and wave soldering. It is easy to separate multiple boards during assembly to avoid damaging the circuit board during separation. Determine which assembly method to use based on the shape of the single type of board you are assembling. The main ways of PCB layout are V-CUT, punc
PCB (Printed Circuit Board) vias are a crucial step in PCB design. From the basic concept of via, it is mainly used to connect electrical connections between different layers of PCB. In multi-layer PCB design, signals need to be transmitted between different signal layers, and vias provide such a channel. Vias usually consist of three parts, namely the hole, the pads around the hole, and the plating layer in the middle. The size of the hole directly affects the production process and cost of the via hole. Generally speaking, the common via hole diameter is between 0.2-0.6mm. When designing through holes, multiple factors need to be considered. From the perspective of signal integrity, the parasitic capacitance and inductance of vias have a significant impact on the transmission of high-speed signals. Parasitic capacitance can cause the rising and falling edges of a signal to slow down, thereby affecting the timing of the signal. Parasitic inductance may generate spike voltage dur
Aluminum substrate: Most fluorescent lamps on the market are made of aluminum substrate. The structures from top to bottom are: circuit board layer, thermal insulation layer, and aluminum substrate. Circuit board layer: Copper foil with strong current carrying capacity is mainly used as the circuit. Copper is relatively expensive, so the thickness of copper foil directly affects the price of aluminum substrate. Some aluminum substrates in the market make the copper foil thinner, which makes the price cheaper, but the current carrying capacity of the product will be reduced. Thermal insulation layer: The best thermal insulation effect is achieved by a special ceramic polymer, but the price is very high. Aluminum substrates made from this material are priced at over 1000 yuan/square meter, which is difficult to accept in China. In order to reduce costs and improve competitiveness in the market, other materials such as epoxy resin and glass cloth are used instead. Aluminum substrat
1、 Wide applicability of technical support In recent years, the product updates and technological innovations of circuit board manufacturers have constantly raised the technical requirements for circuit board production. Therefore, a good circuit board manufacturer has done an excellent job in self-improvement in terms of their own technical level and technical support. Whether it is research on various components or exploration of new circuit board production process technologies, they can meet the various production needs of customers today. 2、 Control product quality and make circuit board samples The core soul of circuit board production lies in the quality control of the circuit board products produced. A successful circuit board manufacturer will invest tremendous effort in managing and controlling the product production line, which directly leads to a high compliance rate of various quality indicators in their circuit board production. For customers, this is naturally the
1、 All tools: A piece of honeycomb coal, high-temperature adhesive paper, soldering iron with temperature control, board washing water, medical needle. 2、 Taking the disassembly and soldering of the computer motherboard BIOS socket as an example: 1. Sample the circuit board and apply high-temperature adhesive tape around the front and back of the BIOS socket (i.e. the back of the motherboard) for protection, leaving only the front and back of the BIOS socket untouched. Medical needles are installed on disposable chopsticks. 2. Ignite the honeycomb coal and remove it from the furnace when it is burning vigorously. Place it flat on the ground for one or two minutes. You must wait for the flame to descend before proceeding to the next step. 3. Place the front and back of the motherboard BIOS socket 3-5 centimeters above the honeycomb center, and use this as the center to continuously move and evenly heat the motherboard. 4. Wait for about 30 seconds for the solder on the board t
1. Layout according to circuit modules, and the relevant circuits that achieve the same function are called a module. The components in the circuit module should adopt the principle of proximity, and digital circuits and analog circuits should be separated; 2. No components or parts shall be mounted within 1.27mm around non installation holes such as positioning holes and standard holes. No components or parts shall be mounted within 3.5mm (for M2.5) or 4mm (for M3) around installation holes such as screws; 3. Avoid laying through holes underneath components such as resistors, inductors (plugs), electrolytic capacitors, etc. to prevent short circuits between the through holes and the component housing after wave soldering; The distance between the outer side of the component and the edge of the board is 5mm; 5. The distance between the outer side of the component solder pad and the outer side of the adjacent plug-in component is greater than 2mm; 6. Metal shell components and
If analog circuits (RF) and digital circuits (microcontrollers) work separately, they may work well on their own, but once they are placed on the same circuit board and powered by the same power source, the entire system is likely to become unstable. This is mainly due to the frequent oscillation of digital signals between ground and positive power supply (3 V in size), and the period is particularly short, often at the ns level. Due to their large amplitude and small switching time, these digital signals contain a large number of high-frequency components that are independent of the switching frequency. In the simulation part, the signal transmitted from the antenna tuning loop to the wireless device receiving part is generally less than 1 μ V. Therefore, the difference between digital signals and RF signals will reach 10-6 (120 dB). Obviously, if digital signals cannot be well separated from radio frequency signals, weak radio frequency signals may be damaged, which can deteriora
1. When marking and making PCB sample slices, you should first know whether your slice is a transverse or longitudinal section of the hole, and where the problem lies. It must be marked with a colored oil pen or tape. Use an arrow to indicate the problem point 2. For circuit board sampling and gluing, if there are bubbles in the holes, the slice has lost its meaning. Therefore, gluing is the foundation of PCB sampling and slicing. The transparent glue used by everyone may be different, but it is only powder glue or blue and white glue There is always a component that is' rare ' Before gluing, please ensure that the sample is clean, otherwise there will definitely be bubbles generated. The method I use is to wipe and clean with a cotton swab dipped in acetone, or use ultrasonic cleaning Then wet it with a "dilute" solvent Or first dilute the glue and carefully fill the small hole with a toothpick Especially blind holes, carefully fill them with toothpicks, and then fill them with t
Regardless of the performance of the soldering flux, it will be more or less corrosive. The residue after soldering the circuit board can cause different problems such as corrosion, leakage, and ion migration. Therefore, removing the residue of soldering flux will certainly be regarded as an important processing task by the industry. And what is the actual effect of the processing? Appropriate methods are also needed for verification and tracking in this regard. The cleaning effect of PCB circuit board after soldering should be based on the amount of residual ion residue at the solder joints. The specification adopted by MIL is MIL-P-2880955110, which should have a resistivity of 6MQ-cm or above during testing. Calculate the resistivity of the measured metal per unit area and after quantitative cleaning. In terms of cleanliness, the resistivity should be maintained above 2MQ-cm. Representative cleanliness testing methods include Ion Ogurafu and Omega Meter, which are recognized as
Standard for PCB sampling and substrate testing methods: 1. IEC61189-1 (1997-03): Test methods for electronic materials, interconnecting structures and components - Part Y: General test methods and methodology. 2. IEC61189 (1997-04) Test Methods for Electronic Materials, Interconnected Structures and Components - Part 2: Test Methods for Interconnected Structure Materials, Revised Y in January 2000 3. IEC61189-3 (1997-04) Test Methods for Electronic Materials, Interconnection Structures and Components - Part 3: Test Methods for Interconnection Structures (Printed Boards), revised Y in July 1999. 4. IEC60326-2 (1994-04) Printed boards - Part 2; The experimental method was revised Y times in June 1992. PCB sampling related material standards 1. IEC61249-5-1 (1995-11) Interconnection structural materials - Part 5: Specification for uncoated conductive foils and films - Part Y: Copper foil (used for manufacturing copper-clad substrates) 2. IEC61249-5-4 (1996-06) Printed boards a
Printed circuit board (PCB) is almost present in every electronic device. If there are electronic components in a certain device, they are also embedded on PCBs of different sizes. In addition to fixing various small parts, the main function of PCB is to provide electrical connections between the various components on top. As electronic devices become increasingly complex and require more and more parts, the circuits and components on the PCB are also becoming denser. A standard PCB looks like this. Bare board (without components on top) is also commonly referred to as "Printed Wiring Board (PWB)". The substrate of the board itself is made of insulated and non bendable materials. The small circuit material visible on the surface is copper foil. Originally, the copper foil covered the entire board, but during the manufacturing process, some parts were etched away, leaving behind a network of small circuits. These circuits are called conductor patterns or wiring, and are used to pro
Copper clad laminate (CCL), also known as copper-clad laminate, is a product made of wood pulp paper or fiberglass cloth as reinforcing materials, impregnated with resin, and covered with copper foil on one or both sides, and then hot pressed. When used in the production of multi-layer boards, it is also called a core board (CORE). At present, the copper-clad laminates available in the market can be mainly divided into the following categories based on substrate: paper substrate, fiberglass cloth substrate, synthetic fiber cloth substrate, non-woven fabric substrate, and composite substrate. The circuit board prototype substrate is an insulating layer board composed of polymer synthetic resin and reinforcing materials; A layer of pure copper foil with high conductivity and good weldability is covered on the surface of the substrate, commonly with a thickness of 35-50/ma; Copper clad laminates with copper foil covering one side of the substrate are called single-sided copper clad
Printed Circuit Board Assembly (PCA) refers to the process of soldering electronic components onto a printed circuit board (PCB). This service is usually provided by professional electronic manufacturing service providers (EMS), covering the entire process from component procurement, inspection, mounting to final testing and quality control. PCA services are widely used in the field of electronic product manufacturing, including multiple industries such as consumer electronics, communication equipment, medical instruments, automotive electronics, and aerospace. In circuit board assembly services, common process flows include surface mount technology (SMT), through-hole insertion technology (THT), and hybrid assembly technology. SMT is suitable for the installation of high-density and miniaturized components, while THT is commonly used for the installation of large or heavy-duty components. Hybrid assembly technology is the combination of SMT and THT to meet the installation needs
Printed Circuit Board Assembly (PCBA) refers to a printed circuit board that has been assembled and soldered, containing various electronic components. It is the process of making a PCB board from a designed circuit diagram through plate making, etching, drilling, and other processes, and then soldering various electronic components (such as resistors, capacitors, transistors, integrated circuits, etc.) onto the PCB board according to the requirements of the circuit design, forming electronic modules or systems with specific functions. PCBA is the core part of modern electronic product manufacturing, widely used in various fields such as consumer electronics, communication equipment, industrial control, medical instruments, automotive electronics, etc. It not only achieves the integration and miniaturization of electronic components, but also improves the stability and reliability of circuits, simplifying the assembly and maintenance process of electronic products. In the product
Prototype circuit board components are important tools for electronic engineers and enthusiasts when developing new products or conducting electronic experiments. These components typically include various electronic components such as resistors, capacitors, inductors, transistors, integrated circuits, etc. During the design phase, engineers need to select and test various components to ensure the performance and reliability of the final product. The quality of prototype circuit board components directly affects the stability and efficiency of the entire system, so selecting high-quality components is crucial. In practical operation, engineers will use breadboards or test boards to build prototype circuits, which can not only quickly verify the feasibility of circuit design, but also facilitate modification and optimization. Through continuous experimentation and adjustment, engineers can find the best combination of components to achieve the expected functionality and performance
Prototype PCB assembly is a crucial step in the electronic manufacturing process, which involves combining the designed circuit board with various electronic components to form a functional electronic device. This process not only requires professional technical knowledge, but also high precision and meticulous operation. In the prototype stage, manual assembly is usually used to ensure that each component can be installed and welded correctly. When assembling the prototype PCB, it is necessary to first prepare all the components and tools. Components include resistors, capacitors, chips, etc., while tools include soldering, soldering iron, tweezers, magnifying glasses, etc. Next, according to the circuit design drawings, install each component onto the PCB one by one. This step requires the operator to have good vision and hand eye coordination skills, as components are very small, especially SMD (Surface Mount Devices) commonly used in modern electronic products. After installa
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