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In the field of modern intelligent manufacturing, copper-clad circuit boards (PCBs) play a crucial role as the core components of electronic devices. Copper clad PCB boards, with their excellent conductivity and reliability, have become the preferred choice for many high-end applications. Copper clad circuit boards form complex circuit patterns by covering a layer of copper foil on the substrate and undergoing processes such as etching and drilling. The excellent conductivity and thermal conductivity of copper make it an ideal material for making circuit boards. Whether used in industrial control, automotive electronics, or medical equipment, copper clad PCB boards can provide stable and efficient current transmission, ensuring the normal operation of the equipment. Our copper clad PCB boards adopt advanced production processes and strict quality control to ensure that each circuit board meets the highest standards. We offer copper foil of various thicknesses and specifications t
In the era of rapid high-tech development, copper clad printed circuit boards (PCBs) play a crucial role as the core components of electronic devices. It not only carries various electronic components, but also is responsible for signal transmission and power supply between them. Copper clad printed circuit boards have become indispensable key components in electronic products due to their excellent conductivity and stability. Our copper clad printed circuit boards use high-quality copper materials and advanced production processes to ensure that each circuit board has excellent electrical performance and mechanical characteristics. Whether it's single-layer board, double-layer board, or multi-layer board, we can provide the most suitable solution according to customer needs. Our circuit boards undergo strict quality control and testing to ensure stable operation in various harsh environments. To meet the needs of different customers, we provide a variety of customized services,
In modern electronic equipment, copper plated printed circuit board (PCB), as the carrier of electronic components and the interconnection network, plays a vital role. It not only carries various electronic components, but also is responsible for signal transmission and power supply between them. Copper plated printed circuit boards have become indispensable key components in electronic products due to their excellent conductivity and stability. Our copper plated printed circuit boards use high-quality copper materials and advanced production processes to ensure that each circuit board has excellent electrical performance and mechanical characteristics. Whether it's single-layer board, double-layer board, or multi-layer board, we can provide the most suitable solution according to customer needs. Our circuit boards undergo strict quality control and testing to ensure stable operation in various harsh environments. To meet the needs of different customers, we provide a variety of
In modern electronic equipment, copper plated printed circuit board (PCB), as the carrier of electronic components and the interconnection network, plays a vital role. It not only carries various electronic components, but also is responsible for signal transmission and power supply between them. Copper plated printed circuit boards have become indispensable key components in electronic products due to their excellent conductivity and stability. Our copper plated printed circuit boards use high-quality copper materials and advanced production processes to ensure that each circuit board has excellent electrical performance and mechanical characteristics. Whether it's single-layer board, double-layer board, or multi-layer board, we can provide the most suitable solution according to customer needs. Our circuit boards undergo strict quality control and testing to ensure stable operation in various harsh environments. To meet the needs of different customers, we provide a variety of
Clad Copper Board (CCB) is one of the important basic materials for producing printed circuit boards (PCBs). It is composed of one or multiple layers of copper foil and insulating substrate, and is widely used in various electronic and communication devices, playing a key role in carrying and connecting electronic components. Firstly, copper clad panels have excellent electrical performance and mechanical strength. The low resistance and high thermal conductivity of copper foil make it an ideal conductive material. And the insulating substrate provides good dielectric properties and support. Through high-temperature pressing process, copper foil and substrate are tightly combined to form a sturdy and durable copper clad plate, which can withstand various harsh working environments and long-term use. Secondly, copper-clad panels have high machinability and adaptability. According to different design requirements, copper clad panels can be processed into various complex circuit pat
1. FR-4 A1 grade copper clad plate This grade is mainly used in electronic products such as military, communication, computers, digital circuits, industrial instruments and meters, and automotive circuits. The quality of this series of products has completely reached the world-class level, making it the highest grade and best performing product of our company. FR-4 A2 grade copper clad plate is mainly used for ordinary computers, instruments and meters, high-end household appliances, and general electronic products. This series of copper-clad laminates is widely used, and all performance indicators can meet the needs of general industrial electronic products. There is a good price performance ratio. Can effectively enhance price competitiveness for customers. 3. FR-4 A3 grade copper clad plate This grade copper clad plate is a FR-4 product developed and produced by our company specifically for the home appliance industry, computer peripheral products, and ordinary electronic prod
The most critical factor in maintaining PCB etching equipment is to ensure the high cleanliness and unobstructed nature of the nozzle, allowing it to spray smoothly. Blockages or slagging can create pressure during spraying, impacting the surface of the board. If the nozzle is not clean, it will cause uneven etching and result in the entire circuit board being scrapped. Obviously, the maintenance of the equipment involves replacing damaged and worn parts, as the nozzle also has wear issues, so the replacement should include the nozzle. In addition, a more critical issue is to maintain the etching machine without slagging, as excessive accumulation of slagging often affects the chemical balance of the etching solution. Similarly, if there is a chemical imbalance in the etching solution, the situation of slagging will become more severe. When a large amount of slag suddenly appears in the etching solution, it is usually a signal indicating that there is a problem with the balance of
1. Use schematic design tools to draw schematic diagrams and generate corresponding network tables. Of course, in some special cases, such as when the circuit board is relatively simple and there is already a network table, it is also possible to enter the PCB design system directly without designing the schematic. In the PCB design system, parts can be directly packaged and a network table can be manually generated. 2. Manually modify the network table to define some components with fixed pins or pads that are not on the schematic diagram to the connected network, and those without any physical connections can be defined to ground or protective ground. Change the pin names of some devices that do not match the schematic and PCB packaging library to match those in the PCB packaging library, especially for diodes and transistors. This step is a very important step. The network table is the soul of PCB automatic wiring and the interface between schematic design and impression circu
It is impossible to manufacture any quantity of PCBs without encountering any issues, mainly due to the material of the PCB copper-clad laminates. When quality problems occur in the actual manufacturing process, it seems that the problem is often caused by the PCB substrate material. Even a carefully written and effectively implemented technical specification for PCB laminates does not specify the testing items that must be carried out to determine whether PCB laminates are the cause of production process problems. Here are some of the most commonly encountered PCB laminate issues and how to confirm them. Once encountering PCB laminate issues, it should be considered to add them to the PCB laminate material specifications. Usually, if this kind of technical specification enrichment work is not carried out, it will lead to continuous quality changes and subsequently result in product scrapping. Usually, material problems caused by changes in the quality of PCB laminates occur in p
Printed circuit board (PCB) is a substrate used for assembling electronic components, with a global output value of 45 billion US dollars per year. It is second only to the semiconductor industry in the electronics industry, and China's growth rate is much higher than the industry average. Nowadays, electronic products are changing rapidly, and price wars have changed the structure of the supply chain. China has both cost and market advantages. The PCB industry is gradually shifting to China due to the impact of cost and downstream industry transfer, and China is the most promising PCB market worldwide. Low end PCBs (below 4 layers) have relatively low barriers to entry, sufficient competition, and low concentration. Due to the pressure of downstream machine price reductions, product prices often face pressure from downstream manufacturers to lower prices. High end PCB (HDI, etc.) technology, equipment, processes, and other requirements are very high, with high barriers to entry and
1. The crystal structure formed by depositing gold is different from that of plating gold. Depositing gold results in a much thicker thickness of gold compared to plating gold. Depositing gold results in a golden yellow color, which is more satisfying for customers. 2. The crystal structure formed by sinking gold is different from that of plating gold, and sinking gold is easier to weld than plating gold, which will not cause poor welding and cause customer complaints. The stress of the sinking gold plate is easier to control, which is more conducive to the processing of products with bonding. At the same time, it is precisely because sinking gold is softer than plating gold, that sinking gold plates are not wear-resistant when making gold fingers. 3. The sinking gold plate only has nickel gold on the solder pad, and the signal transmission in the skin effect is in the copper layer without affecting the signal. 4. Compared to gold plating, sinking gold has a denser crystal struc
Drilling is to connect the outer circuit with the inner circuit, and the outer circuit is connected to the outer circuit. Anyway, drilling is to connect the circuits between different layers. In the later electroplating process, copper plating can be applied to the holes to connect the circuits between different layers. Some drilling holes are screw holes, positioning holes, row holes, etc., and their respective purposes are different. Drilling is to drill the required through holes on the copper clad plate. Through holes mainly provide electrical connections and serve as fixing or positioning devices. PCB through-holes are divided into two categories based on whether they are metallized or not a. Electroplated Holes (PTH), also known as Metallized Holes b. Non electroplated hole (NPTH): also known as non-metallic hole Divided by process a. Blind hole (multi-layer board) b. Buried hole (multi-layer board)
There is a very common process used in the surface treatment of circuit boards, known as the gold deposition process. In production, the cost of sinking gold plates is relatively high, and generally, sinking gold technology is not used. So how do we distinguish which type of PCB board requires sinking gold? Which type of circuit board does not require sinking gold? Analysis and judgment can be made based on the following situations. 1. The board has gold fingers that need to be plated with gold, but the layout other than the gold fingers can choose processes such as tin plating or gold plating according to the situation, which is the usual "gold plating+gold plating finger" process and "tin plating+gold plating finger" process. Occasionally, a few designers choose the full page gold plating method to achieve the goal in order to save costs or time, but the gold plating cannot reach the thickness of the plating. If the gold fingers are frequently inserted and peeled, poor connectio
A. Urea paperboard The characteristic is: the color is light yellow, commonly used for single panel, but due to being made of urea paper, it is easy to rot in cool and humid places, so it is no longer commonly used B. CAM-3 board The characteristics are: milky white color, good toughness, high CTI (600V), and only a quarter of the normal carbon dioxide emissions. It is now more commonly used in single panels C. FR4 fiberboard The characteristics are: made of fibers, with good toughness, and threads pulling each other when broken. It is commonly used in multiple panels, with a thermal expansion coefficient of 13 (16ppm/c). The mother board used in our factory is made from this board D. Multi-layer board Features: high Tg, high heat resistance and low thermal expansion rate, low dielectric constant and dielectric loss material, commonly used for four or more layers E. Soft board Features: Soft and transparent material, commonly used at the electrical connection between two b
(1) Provide mechanical support for fixing and assembling various electronic components such as integrated circuits (2) Implement wiring and electrical connections or electrical insulation between various electronic components such as integrated circuits (3) Provide the required electrical characteristics, such as characteristic impedance, etc (4) Provide solder mask graphics for automatic soldering, identifier symbols and graphics for component insertion, inspection, and maintenance 1) Reduce lead content The method of using electroplating lead and tin to produce graphic electroplating is rapidly being phased out. In the future, there will be more conversion towards panel plating (also known as panel plating) process. With the use of graphic electroplating, electroplating tin will also become mainstream. In the case of using solder, solder will be converted to lead-free materials, and there will be greater progress in this area in the future. It is expected that this transformat
The generation of a schematic diagram is generally regarded as the first step in the PCB production process, and it is also the specific implementation of product ideas by electronic engineering technicians. It is composed of many logical components (such as gate circuits, resistors, capacitors, etc. of various ICs) connected through different logic connections. Creating a schematic diagram, the source of its logical components is a large logical component library (such as TANGO PADS) contained in some CAD software. In addition to the logical component library, some CAD software can also be added by users to create new logical components (such as Cadence, Mentor, Zuken, etc.), which users can use to achieve the logical functions of the product they want to design. Due to the large number of logical components, building them in one library can easily cause confusion and be difficult to manage. Therefore, logic components with similar functional characteristics are generally placed
1. Silk screen Screen printing is the most important component in screen printing plate making, because it is the key to controlling the fluidity of ink and printing thickness. At the same time, it determines the durability of screen printing and is widely used in quality switch manufacturing technology. In addition, the excellent combination of silk screen and screen photosensitive materials is also an important factor in producing high-quality and high-precision screen printing plates. In order to ensure a good combination of the screen and photosensitive materials, the traditional approach is to roughen and degrease the new screen, which can ensure the quality of the screen and extend the service life of the screen. 2. Plate photosensitive materials Commonly used photosensitive materials for printing plates include diazo photosensitive agents, photosensitive films, etc. The commonly used photosensitive emulsion in screen printing is diazo type. The photosensitive film has the
The viscosity of liquid photosensitive solder mask ink is mainly controlled by the ratio of hardener to main agent and the amount of diluent added. If the amount of hardener added is not enough, it may cause an imbalance in ink characteristics. After the hardener is mixed, it will react at room temperature, and its viscosity changes as follows. Within 30 minutes: The main ink agent and hardener have not yet fully integrated, resulting in insufficient fluidity and clogging of the screen during printing. 30 minutes to 10 hours: The ink main agent and hardener have been fully integrated, and the fluidity is appropriate. After 10 hours, the reactions between the various materials of the ink itself continue to take place proactively, resulting in increased fluidity and difficulty in printing. The longer the hardener is mixed, the more complete the reaction between the resin and hardener, and as a result, the gloss of the ink also improves. To ensure even ink gloss and good printabili
1. Engineering design The arrangement of interlayer semi cured sheets should correspond; Multi layer core boards and semi cured sheets should use the same supplier's products; The area of the outer C/S surface graphics should be as close as possible, and independent grids can be used; 2. Drying the board before cutting Generally, at 150 degrees Celsius for 6-10 hours, the moisture inside the board is eliminated to further solidify the resin completely and eliminate stress inside the board; Bake the board before cutting, whether it is the inner layer or both sides! 3. Attention should be paid to the warp and weft directions of the cured sheets before laminating multi-layer boards The contraction ratio in the warp and weft directions is different. Before cutting and stacking the semi cured sheet, pay attention to distinguishing the warp and weft directions; When cutting the core board, attention should also be paid to the warp and weft directions; The general direction of the cu
The experience given by circuit board manufacturers is to choose components with large volume, multiple pins, and a major role in the circuit, such as integrated circuits, transformers, transistors, etc., as drawing reference components. Then, starting from each pin of the selected reference component, drawing can reduce errors, and error prevention is also important in the manufacturing industry. 2. If component numbers (such as VD870, R330, C466, etc.) are marked on the printed circuit board, due to the specific rules of these numbers, components with the same first Arabic numeral after the English letter belong to the same functional unit. Therefore, they should be cleverly utilized when drawing. Correctly distinguishing the components of the same functional unit is the foundation of drawing layout. There are many methods in the circuit board manufacturing methods of circuit board factories that can be applied to restore the circuit schematic. 3. If the serial number of the co
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