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Several material classifications for PCB circuit boards PCB circuit board substrates from PCB prototyping manufacturers can be divided into several types based on quality, material, and fire rating: PCB circuit boards 94HB cardboard: The most common cardboard material, mostly used to make low-grade single panels, with a cheap price. Due to its lack of flame retardant properties, it cannot be used for a series of products with fire protection requirements such as power supplies. 94V0 cardboard: A cardboard material with flame retardant properties, which contains flame retardant additives in its composition compared to 94HB cardboard material. 22F single-sided composite substrate: single-sided semi fiberglass board. CEM-1 single-sided composite substrate: This material requires CNC drilling. CEM-3 double-sided composite substrate: Low end double-sided board material, belonging to semi fiberglass material. FR-4 epoxy resin glass fiber board: the most commonly used PCB board mater
The Importance of PCB Equipment In the PCB industry, PCB sampling has the saying of "three parts technology and seven parts equipment", which well points out the important position of instrument equipment in the competition of the PCB industry. PCB equipment, as an important link in the PCB industry chain, directly affects the product quality of circuit boards. Therefore, in order for China's PCB industry to become stronger and bigger, the most important thing is to develop the instruments and equipment related to the PCB industry. Today, the editor will analyze the importance of PCB instrument equipment for everyone. One of the reasons why Chinese PCBs are not strong enough is that the high-end instruments and equipment in the PCB industry are still lagging behind. The accuracy, performance, and reliability of domestic instruments and equipment still have a gap with foreign ones, which leads to many of our PCB instruments and equipment still relying on imports. Not only are we fas
PCB suppresses interference sources Suppressing interference sources means minimizing their du/dt and di/dt as much as possible. This is the top priority and most important consideration in anti-interference design The principle often achieves twice the result with half the effort. Reducing the du/dt of the interference source is mainly achieved by paralleling capacitors at both ends of the interference source To achieve. Reducing the di/dt of the interference source is achieved by connecting an inductor or resistor in series with the interference source circuit and adding a freewheeling diode. The common measures to suppress interference sources are as follows: (1) Add a freewheeling diode to the relay coil to eliminate the back electromotive force interference generated when the coil is disconnected. Only adding a freewheeling diode will By delaying the disconnection time of the relay and increasing the voltage regulator diode, the relay can operate more times per unit time.
Characteristics of Circuit Board Assembly Integrated Circuit With the continuous development of technology, integrated circuits have gradually become a widely used circuit mode for circuit board assembly. So, what is the reason why integrated circuits are so popular? This starts with its characteristics. Integrated circuits for circuit board assembly have the advantages of small size, light weight, fewer lead wires and solder joints, long lifespan, high reliability, and good performance. At the same time, they have low cost and are easy to mass produce. It is widely used not only in industrial and civilian electronic devices such as recorders, televisions, computers, but also in military, communication, remote control, and other fields. Using integrated circuits for circuit board assembly can increase the assembly density by tens to thousands of times compared to transistors, and greatly improve the stable working time of equipment.
Professional PCB manufacturers' standards for printed circuit boards 1. IEC60326-4 (1996-12) Printed boards - Part 4: Internally connected rigid multilayer printed boards - Sectional specification. 2. IEC60326-4-1 (1996-12) Printed boards - Part Y4: Internally connected rigid multilayer printed boards - Sectional specifications - Part Y: Detailed specifications for capabilities - Performance levels A, B, C. 3. IEC60326-3 (1991-05) Printed boards - Part 3: Design and use of printed boards. 4. IEC60326-4 (1980-01) Printed Boards - Part 4: Specification for Single sided and Double sided Ordinary Printed Boards (this standard was revised Y times in November 1989). 5. IEC60326-5 (1980-01) Printed Boards - Part 5: Specification for Single sided and Double sided Ordinary Printed Boards with Metallized Holes (Yth Revision, 1989). 6. EC60326-7 (1981-01) Printed boards - Part 7: Specification for single and double-sided flexible printed boards (without metalized holes) (revised Y in Nove
Wave soldering technology 1： Wave soldering is the process of forming a specific shape of solder wave on the liquid surface of a solder tank using molten liquid solder and the action of a pump. The solder wave is then placed on a PCB with electronic components and transported on a chain, passing through the solder wave at a specific angle and immersion depth to achieve solder joint soldering. PCB circuit board 2： Wave crest surface: The surface of the wave is covered by a layer of oxide skin, which remains almost static along the entire length of the solder wave. During the wave crest soldering process, the PCB comes into contact with the leading surface of the tin wave, causing the oxide skin to break and pushing the tin wave in front of the PCB forward without any cracks or wrinkles 3： Solder joint formation: When the PCB enters the front end (A) of the wave crest, the substrate and pins are heated, and before leaving the wave crest (B), the entire PCB is immersed in solder, bri
The detachment between the copper holes on the circuit board and the copper substrate, and even the continuity at the corners of the interface Causing increased pollution of the neutralization tank by potassium permanganate, and poor water washing after removing the gel with potassium permanganate. Greatly reducing the service life and neutralization effect of the neutralization tank, resulting in residual potassium permanganate in the hole, affecting the subsequent copper deposition effect, causing some potential quality problems, poor copper deposition backlight, poor hole wall adhesion, no copper in the hole, hole wall detachment, blowing holes, bursting holes, etc; In addition, when the circuit board is more serious, excessive potassium permanganate will react with the neutralizing agent in the tank solution and produce a pale yellow substance, which will then adsorb onto the hole wall or inner copper ring, causing quality hazards such as poor inner layer connections, open circu
In PCB board sampling, Rx is a resistor. There are many resistors in the circuit diagram, arranged in sequence, R1, R2... Cx is a non-polar capacitor, an anti-interference capacitor at the power input end IC integrated circuit module Ux is an IC (Integrated Circuit Component) Tx is a testing point (used for factory testing) Spk1 is a speaker (buzzer, horn) Qx is a transistor CEx electrolytic capacitor, CNx discharge capacitor, RNx discharge resistor, CONx connector, Dx diode, Lx inductor/magnetic bead, LEDx light-emitting diode, Xx crystal oscillator. RTH (Thermistor) CY (Y capacitor: high-voltage ceramic capacitor, safety standard) CX (X capacitor: high-voltage thin film capacitor, safety regulations) D (diode) W voltage regulator tube K switch type Y crystal oscillator R117: The resistor on the motherboard, serial number 17. T101: Transformer on the motherboard. SW102: Switch LED101: Light Emitting Diode LAMP: (indicator) light Q104 (E, B, C): transistor, E: e
There are several commonly used copper-clad laminates, including the following There are also many types of copper-clad laminates. According to different insulation materials, it can be divided into paper substrate, glass cloth substrate, and synthetic fiber board; According to the different adhesive resins, they can be divided into phenolic, epoxy, polyester, and polytetrafluoroethylene, etc; It can be divided into general and special types according to its purpose. The structure and characteristics of commonly used copper-clad laminates in China (1) Copper foil phenolic paper laminated board is a laminated product made by impregnating insulation impregnated paper (TFZ-62) or cotton fiber impregnated paper (1TZ-63) with phenolic resin and hot pressing. The two surfaces of the adhesive paper can be attached with a single alkali free glass impregnated tape, and one side is coated with copper foil. Mainly used as printed circuit boards in wireless equipment. (2) Copper clad phenoli
What are the aging testing methods for PCBs? The aging test of PCB (printed circuit board) is to evaluate its performance and reliability during long-term use. Here are some common aging testing methods: 1. High temperature aging test: Constant temperature aging: Place the PCB in a high temperature environment, usually between 70 ° C and 150 ° C, for a period of time, and observe its performance changes under high temperature conditions. Temperature cycle: Cycle between high and low temperatures, simulate temperature changes in actual usage environments, and evaluate the thermal stability of PCBs. 2. Damp heat aging test: Constant humidity and heat: Place the PCB in a high-temperature and high humidity environment, typically at 85 ° C and 85% relative humidity, to test its performance changes under humid and heat conditions. Damp heat cycle: Cycle under different humidity and temperature conditions to evaluate the moisture resistance of PCB. 3. Voltage stress test: Overvolta
How to determine the health status of PCB? To determine the health status of a PCB (printed circuit board), multiple factors need to be considered comprehensively. The following are some commonly used methods and precautions: Visual inspection: Appearance: Check the surface of the PCB for obvious damage, cracks, scratches, discoloration, or corrosion. Solder joint: Check if the solder joint is full, smooth, and if there are any issues such as virtual soldering, short circuits, or open circuits. Component: Check whether the electronic components are intact, whether there is any burning, cracking, loosening or missing phenomenon. Tool detection: Multimeter: Use a multimeter to measure the resistance, voltage, and current of a circuit, and check for short circuits, open circuits, or abnormal resistance. Oscilloscope: Use an oscilloscope to detect the signal waveform of a circuit and determine whether there is noise, distortion, or other abnormal phenomena. Thermal imaging devic
Printed Circuit Board Assembly (PCBA) is a critical step in electronic product manufacturing, involving the soldering of various electronic components (such as resistors, capacitors, integrated circuits, etc.) onto PCBs to form electronic modules or systems with specific functions. PCBA services not only include component mounting and soldering, but also cover a series of work such as preliminary design layout, component procurement and management, quality inspection, and later functional testing and troubleshooting. In PCBA services, manufacturers typically use advanced production equipment and technologies such as high-speed surface mount machines, reflow ovens, wave soldering machines, and automatic optical inspection (AOI) systems to ensure assembly quality and production efficiency. In addition, in order to meet the needs of different customers, PCBA service providers also need to have flexible production scheduling capabilities and strong supply chain management capabilities
The cost calculation of PCB assembly involves multiple factors, including but not limited to the following aspects: Raw material cost: This is the main component of PCB assembly cost. Raw materials include substrate materials (such as FR-4), copper foil, solder mask ink, character ink, electroplating materials, etc. The price of each material will fluctuate based on factors such as market supply and demand, quality level, etc. Manufacturing process cost: Different manufacturing processes can affect costs. For example, the manufacturing process of multi-layer boards is more complex and costly than single-layer boards; High precision and high-density wiring design will also increase manufacturing difficulty and cost. Labor cost: Labor cost includes the salaries of workers directly involved in production and related management expenses. The labor cost may vary depending on the region, technological level, and labor efficiency. Equipment depreciation and maintenance costs: The inve
Common problems and solutions for PCB aging testing During the PCB aging testing process, some common problems may be encountered. Here are these problems and their solutions: 1. Inconsistent test data: Reason: It may be due to unstable testing environment, insufficient accuracy of testing equipment, or improper operation. Solution: Ensure that the testing environment meets the requirements, use calibrated testing equipment, standardize operating procedures, and repeat testing to verify the consistency of results. 2. Testing time is too long: Reason: Aging testing usually takes a long time, which may result in a long testing cycle and affect research and production progress. Solution: Adopt accelerated aging testing methods, such as high-temperature aging, wet heat aging, etc., to shorten testing time and improve testing efficiency. 3. High testing costs: Reason: Aging testing may require expensive testing equipment and materials, resulting in high testing costs. Solution:
design and manufacture higher quality PCBs. Data analysis method for PCB aging testing After conducting PCB aging testing, data analysis is an important step in evaluating PCB performance and reliability. Here are some commonly used data analysis methods: 1. Trend analysis: Time series analysis: Arrange test data in chronological order, observe the trends of various indicators over time, and identify signs of aging. Regression analysis: Use linear regression or nonlinear regression models to fit test data and predict the aging rate and lifespan of PCBs. 2. Statistical analysis: Mean and standard deviation: Calculate the mean and standard deviation of test data to evaluate the stability and consistency of PCB performance. Confidence interval: Calculate the confidence interval of test data to evaluate the credibility and reliability of the results. 3. Failure Mode Analysis: Fault Tree Analysis (FTA): Construct a fault tree to analyze the causes and effects of various fault mo
Prototype printed circuit board component Prototype printed circuit board (PCB) components refer to printed circuit boards used for developing and testing electronic circuits. This type of PCB typically has a universal design that allows users to install various electronic components such as resistors, capacitors, transistors, etc. on it. Compared with traditional circuit boards, prototype PCBs have higher flexibility and scalability, allowing engineers to try multiple circuit design solutions on one platform. Prototype PCB components typically include basic wiring patterns, solder pads, and vias for easy soldering and connection of components. In addition, some advanced prototype PCBs may also include pre fabricated circuit modules, such as power management modules, sensor interfaces, etc., which can greatly simplify the circuit design process and improve development efficiency.
Low cost prototype PCB assembly In the development process of modern electronic products, prototype PCB (printed circuit board) assembly is an indispensable part. Cost control is particularly important for startups and individual developers. Low cost prototype PCB assembly can not only save expenses, but also accelerate the speed of product launch. The key to achieving low cost lies in selecting suitable materials, optimizing design, and mass production. Firstly, choosing materials with lower costs but reliable quality is an effective way to reduce costs. For example, using standard FR-4 substrates instead of more expensive high-frequency materials can reduce material costs while ensuring performance. Secondly, optimizing circuit design can reduce the number of components and circuit board area, thereby reducing manufacturing costs. In addition, planning the circuit layout reasonably and avoiding complex multi-layer board designs can significantly reduce costs. Mass production is
Rapid prototyping PCB assembly In the early stages of electronic product development, rapid prototyping PCB assembly is crucial. It can not only help engineers validate design concepts, but also accelerate product iteration and obtain market feedback. Rapid prototyping PCB assembly typically involves several key steps: design, manufacturing, and testing. Firstly, the design phase requires the use of professional EDA (Electronic Design Automation) software such as Altium Designer, KiCad, etc. These tools can help engineers quickly create circuit schematics and layout designs. By utilizing the simulation capabilities of these software, potential design issues can be identified and corrected before actual manufacturing, thereby shortening the development cycle. Secondly, in the manufacturing phase, selecting PCB manufacturers with fast turnover capabilities is crucial. Many manufacturers provide fast prototyping services, which can complete the entire process from raw material procur
PCB prototype assembly PCB prototype assembly refers to the process of assembling a designed prototype PCB with various electronic components. This process not only requires high-precision welding techniques, but also requires a deep understanding of circuit design. During the assembly process, engineers will solder each component onto the corresponding pad according to the circuit diagram, and then perform debugging and testing. To ensure the quality of PCB prototype assembly, professional assembly equipment and tools such as precision soldering irons, optical inspection instruments, etc. are usually used. In addition, some auxiliary materials such as solder paste, flux, etc. will be used to improve the reliability and aesthetics of welding. After assembly, engineers will conduct detailed testing on the PCB, including electrical testing, functional testing, and environmental testing, to ensure its stability and performance under various conditions. In short, both the selection of
PCB Prototype and Assembly PCB prototyping and assembly are key steps in the development process of electronic products. PCB prototype refers to a small batch or individual printed circuit board produced before large-scale production, used for testing and verifying the correctness of circuit design. This process usually includes steps such as circuit design, layout, etching, and drilling. Once the prototype PCB is completed, engineers will conduct detailed testing and debugging to ensure that the functionality and performance of the circuit meet expectations. PCB assembly is the process of soldering various electronic components onto a PCB. This step requires high precision and meticulous operation to ensure that each component can be connected and work correctly. Modern PCB assembly typically uses automated equipment such as surface mount machines and reflow ovens to improve production efficiency and quality. After assembly, a series of tests will be conducted, including functiona
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