Client B sought to improve the performance of their high-performance computing device, particularly in heat dissipation and signal integrity. The existing PCB design could not effectively dissipate heat, causing the device to overheat under high load. Additionally, with increasing computing demands, signal integrity issues began to impact the device's performance and reliability. 

We recommended using a higher thermal conductivity substrate, such as a copper-based board like TU872, to improve heat dissipation. Additionally, by optimizing the circuit layout and employing differential signal design, we reduced crosstalk and signal attenuation, enhancing signal integrity. The improved PCB showed significant temperature reduction and signal quality enhancement during testing. The performance of the computing device was enhanced, improving user experience and boosting its market competitiveness.