Client A is developing a smart wearable device, entering the smart wearables market for the first time. The company lacks experience in designing and producing PCBs suitable for this device.

Considering that wearable devices require the circuit board to be compact and lightweight while integrating all necessary electronic components, including sensors, microprocessors, and wireless communication modules, we utilized advanced CAD software for circuit design to ensure the layout was optimized for the tight space. During production, high-density interconnect (HDI) technology, micro vias, and fine line width/spacing were used to meet the miniaturization requirements. We successfully developed a PCB that met the design specifications, fulfilled the functional needs of the smart wearable device, and maintained the product's lightness and comfort. This product later achieved good sales in the market.