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    reflow reflowing pcb oven double sided printed circuit board

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    reflow reflowing pcb oven double sided printed circuit board

    reflow reflowing pcb oven double sided printed circuit board

    Product Description

    Key Features and Benefits


    Our double-sided printed circuit boards (PCBs) are designed for high-performance and reliability, making them ideal for a wide range of electronic applications. Reflow soldering in a PCB oven ensures excellent solder joint quality, essential for complex and densely populated circuit designs.


    Key Features:

    Double-Sided Design: Two layers of copper on both sides of the PCB provide enhanced routing options and higher component density, ideal for sophisticated and compact designs.

    Reflow Soldering: Utilizes advanced reflow soldering techniques to ensure robust and reliable solder joints. This process improves the electrical and mechanical connection between components and the PCB.

    High-Quality Materials: Manufactured using premium FR4 substrate with high thermal stability and mechanical strength, ensuring durability and consistent performance.

    Precision Manufacturing: Advanced manufacturing processes ensure precise and consistent production, meeting tight tolerances and quality standards.

    Surface Finish Options: Various surface finish options such as HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservatives) to meet different application requirements and ensure optimal solderability.

    Cost-Effective Solution: Provides an economical option for producing high-quality, high-performance PCBs without the need for more expensive multi-layer alternatives.

    Lead-Free Compliance: Constructed with environmentally friendly, lead-free materials, adhering to RoHS (Restriction of Hazardous Substances) standards.

    Customizable Options: Available in various thicknesses, copper weights, and surface finishes to meet specific project requirements.

    Rapid Prototyping: Quick turnaround times for prototypes and production runs, supporting fast-paced development cycles and time-to-market.


    Thermal Management Capabilities


    Effective thermal management is critical for maintaining the performance and reliability of double-sided PCBs. Our PCBs are designed with advanced thermal management capabilities to ensure optimal operation even under high thermal loads.


    Thermal Management Details:

    Thermal Vias: Incorporation of thermal vias to efficiently conduct heat away from high-power components, distributing it across the PCB to prevent localized overheating.

    Heat Sinks: Capability to integrate heat sinks directly onto the PCB, providing additional cooling for high-power components and improving overall thermal performance.

    Copper Weight: Utilization of heavier copper weights (up to 3oz) for better heat dissipation, ensuring that the PCB can handle higher current loads without overheating.

    Thermal Pads: Design includes thermal pads under high-power components to enhance heat transfer away from the components, ensuring they remain within safe operating temperatures.

    Thermal Plane Layers: Inclusion of dedicated thermal plane layers within the PCB to distribute heat more effectively and reduce thermal resistance.

    Advanced Substrates: Use of advanced substrate materials with higher thermal conductivity, such as metal-core PCBs, to improve heat dissipation and thermal performance.

    Simulation and Testing: Thermal simulation and testing during the design phase to identify and mitigate potential thermal issues, ensuring reliable operation under various thermal conditions.

    Reflow Profile Optimization: Optimization of the reflow soldering profile to ensure consistent and reliable solder joints without overheating components or the PCB.

    Insulated Metal Substrate (IMS): Optional use of IMS for applications requiring exceptional thermal management, providing superior heat dissipation for high-power and high-frequency applications.

    Conformal Coating: Application of conformal coatings to protect the PCB and components from thermal stress, enhancing reliability and lifespan.


    Our double-sided PCBs with advanced thermal management capabilities ensure that your electronic designs operate reliably and efficiently, even in high-power and high-temperature environments. Contact us today to learn more about how our PCB solutions can enhance the performance and reliability of your electronic projects.

    Get your instant price
    Need help? Tell us about your project. Or call +86 755 2794 4155
    Get your instant price
    Need help? Tell us about your project. Or call +86 755 2794 4155

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