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From FR4,high TG,Polyimide to high-power, RF, and specialized materials β€” explore all PCB product categories including HDI and rigid-flex for modern hardware.

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Products & Services

PCB Product

Comparison Table


  HDI PCB

HDI PCB

 		Rigid-Flex PCB

Rigid-Flex PCB

 		Multilayer PCB

Multilayer PCB
(Standard)

 		Heavy-Copper PCB

High-Power
Heavy-Copper PCB

 		Metal Core PCB

Metal Core PCB

 		High-Speed Low-Loss PCB

High-Speed
Low-Loss PCB

 		Flexible PCB FPC

Flexible PCB
(FPC)
Lead Time7-18 Days 10-18 Days 5-15 Days 5-15 Days 5-15 Days 5-15 Days 5-10 Days
Layer Count 4–12 Layers Rigid: 2–10 Layers
Flex: 1–4 Layers 		4-32 Layers 2–10 Layers 2–8 Layers 4–20 Layers 1-4 Layers
Supported Materials FR-4 high-Tg / low-Dk laminates Polyimide / FR-4 / adhesive-less PI FR-4 / high-Tg FR-4 FR-4 / high-Tg FR-4 Copper Core / Aluminum Core / FR-4 Megtron 6/7, Tachyon, TU-872, low-Dk/Df FR-4 Polyimide / adhesive-less PI
Typical Applications IoT / Wearables / Smartphones / Compact Modules AR/VR / Foldable Devices / Medical Wearables Industrial / Automation / Consumer Electronics Power Electronics / Chargers / Motor Control LED Lighting / DC-DC Converters / Power Control / Thermal Boards 5G / Servers / Telecom Equipment Wearables / Cameras / Connectors / Sensors
Key Features

β—Ž 2-3 levels microvia

β—Ž Fine-pitch BGA fan-out

β—Ž Impedance control

β—Ž Dynamic bending

β—Ž Stable interconnects

β—Ž Weight reduction

β—Ž Cost-effective

β—Ž Stable performance

β—Ž Widely applicable

β—Ž High current carrying

β—Ž Thermal via arrays

β—Ž HV spacing

β—Ž Efficient heat dissipation

β—Ž High thermal conductivity

β—Ž Stable mechanical structure

β—Ž 10–112G SerDes

β—Ž Low skew

β—Ž Backdrill support

β—Ž Ultra-thin

β—Ž Small bending radius

β—Ž Dynamic flex


Learn More Learn More Learn More Learn More Learn More Learn More Learn More

The comparison above describes standard configurations. Higher-layer counts and special material or copper requirements are reviewed against your stackup, quantity and manufacturing files. Lead times are confirmed after engineering review and material availability checks.

Our PCB Capabilities

β€”are summarized in clear tables.

They help engineers quickly evaluate manufacturability and match real PCB performance with high-speed or high-power design requirements.

  1. 01Core electrical specs
  2. 02Material and stackup design options
  3. 03Impedance & Signal Performance
Shenzhen KnownPCB Technology Co., Ltd.

Product TypeMin Trace/SpaceMin Drill / MicroviaAspect RatioMax LayersBoard Size MaxHDI LevelsBlind/Buried ViaVia FillingBackdrill
HDI PCBπŸ”΅ 2/2 mil

πŸ”΅ 0.075–0.1 mm

 laser via

1:1 (microvia) / 

1:10 (TH)

πŸ”΅ 12–16LπŸ”΅ 250Γ—310 mm1–3 levelsYesresin / copper-filledYes
Rigid-Flex PCBπŸ”΅ 3/3 mil0.1 mm laser1:1–1:12πŸ”΅ 10LπŸ”΅ 350Γ—600 mm1 levelNo (usually)NoNo

RF / Microwave PCB

4/4 milmechanical only1:082–8LπŸ”΅ 400Γ—500 mm–NoNoNo

High-Speed / 

Low-Loss PCB

πŸ”΅ 3/3 millaser optional1:104–20LπŸ”΅ 300Γ—500 mm1–2 levelsYesresinYes
Heavy-Copper PCB6/6 mil (2 oz)mechanical only1:082–10LπŸ”΅ 350Γ—450 mm–NoNoNo
8/8 mil (4–6 oz)
Multilayer PCBπŸ”΅ 3/3 milmechanical1:10πŸ”΅ 4–32LπŸ”΅ 450Γ—600 mm–OptionalNoOptional
FPC (Flex PCB)3/3 mil0.1 mm laser1:1–1:101–4LπŸ”΅ 300Γ—500 mm–NoNoNo



Product Supported Material Systems Tg Range Low-Loss Options Special Requirements
HDI FR-4 high-Tg, S1000H 150–170Β°C – thin cores (50–75 Β΅m)

Rigid-Flex

PI (adhesive / non-adhesive)

 FR-4

150–200Β°C–bend radius validation
RF PCB

Rogers 4003/4350B/

 PTFE,/hydrocarbon

120–200Β°CYesDk/Df stability
High-Speed PCBMegtron 6/7, Tachyon, IT-88180–200Β°CYeslow roughness foil
Heavy-CopperFR-4 / FR-5130–170Β°C–thick copper lamination
Multilayer PCBFR-4 / FR-5130–150Β°C–high aspect ratio control
FPCPolyimide200–260Β°C–flex reliability


Factors HDI PCB Rigid-Flex RF PCB High-Speed PCB Heavy-Copper PCB Multilayer PCB FPC
Thermal Cycling goodexcellentmediumgoodgoodgoodmedium
Vibration Resistance goodgoodmediumgoodexcellentgoodlow

Flex/Bend Life –excellent––––excellent
Via Reliability highmediummediumhigh (backdrill optional)highmedium–

Max Copper Weight 1 oz1 oz rigid / 0.5 oz flex1 oz1 ozπŸ”΅ 2–6 oz1–2 oz0.5–1 oz
Thermal Via Support YeslimitedlimitedoptionalYesYesImpedance & Signal Performance

Heat Spreading limited––plane–basedstronggood–
Suitable Applications IoT, wearablesAR/VR, medicalantennas, RF modulesservers, telecompower electronicsindustrialwearables





Capability limits depend on the material, stackup and process combination. Please submit your Gerber and requirements so our engineers can confirm the applicable manufacturing limits.

Advanced PCB Technology & Reliability Capabilities

Controlled Impedance for High-Speed & RF Paths

Stable impedance for MIPI, USB, LVDS, PCIe, 5G NR, Wi-Fi/BLE RF, and 10–112G SerDes.

Maintains signal quality through:

  • Precise dielectric thickness
  • Consistent copper-reference planes
  • Low-loss / low-Dk / low-Df stackups

HDI Microvia Reliability (Stacked & Staggered)

Verified microvia integrity for fine-pitch BGA fan-out, sensor clusters, and compact IoT modules:

  • stable laser via formation
  • controlled plating and copper filling
  • copper balancing to avoid via fatigue underthermal cycling

High-Temperature & High-Tg Stackups for Harsh Environments

Thermally stable materials for automotive (AEC-Q100 electronics), aerospace (–55Β°C to +150Β°C), and industrial control:

  • high-Tg FR-4 / FR-5

  • polyimide for wide thermal cycling

  • CTE-matched stackups to reduce warpage

Heavy-Copper Thermal Management for High-Power Electronics

For power converters, motor drivers, chargers, BMS, PMIC zones:

  • 2–6 oz copperoptions

  • thermal-via grids
  • heat-spreading planes for MOSFETs / IGBTs /SiC devices

Rigid-Flex Mechanical Stability under Repeated Bending

Designed for wearables, AR/VR headsets, medical sensors, and dynamic cable replacements:

  • bend-radius validation

  • flex-tail stress analysis
  • adhesive-less PI for long bending life

RF Loss & Phase Stability for Microwave/mmWave Designs

For antennas, radar front-ends, GNSS, BLE/WiFi modules, 24/60/77 GHz automotive radar:

  • low-loss PTFE / hydrocarbon laminates

  • smooth copper for reduced conductor loss
  • stable Dk across frequency and temperature



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