Standard for PCB sampling and substrate testing methods:

　　1. IEC61189-1 (1997-03): Test methods for electronic materials, interconnecting structures and components - Part Y: General test methods and methodology.

　　2. IEC61189 (1997-04) Test Methods for Electronic Materials, Interconnected Structures and Components - Part 2: Test Methods for Interconnected Structure Materials, Revised Y in January 2000

　　3. IEC61189-3 (1997-04) Test Methods for Electronic Materials, Interconnection Structures and Components - Part 3: Test Methods for Interconnection Structures (Printed Boards), revised Y in July 1999.

　　4. IEC60326-2 (1994-04) Printed boards - Part 2; The experimental method was revised Y times in June 1992.

　　PCB sampling related material standards

　　1. IEC61249-5-1 (1995-11) Interconnection structural materials - Part 5: Specification for uncoated conductive foils and films - Part Y: Copper foil (used for manufacturing copper-clad substrates)

　　2. IEC61249-5-4 (1996-06) Printed boards and other interconnecting structural materials - Part 5: Specification for uncoated conductive foils and films - Part 4; Conductive ink.

　　3. IEC61249-7- (1995-04) Interconnection structural materials - Part 7: Specification for suppression core materials - Part Y: Copper/Invar/Copper.

　　4. IEC61249-8-7 (1996-04) Interconnection structural materials - Part 8: Specification for non-conductive films and coatings - Part 7: Marking inks.

　　5. IEC61249 8 8 (1997-06) Interconnection structural materials - Part 8: Specification for non-conductive films and coatings - Part 8: Polymer coatings.