Introduction for SMT and DIP

Introduce for Printed Circuit Board Assembly is to plug the SMT and the DIP in the Printed Circuit Board,also called PCBA.

Both SMT and DIP are means of integrating components in the PCB board. 

SMT for Printed Circuit Board Assembly:

　　SMT stands for Surface Mount Technology.Mainly use the paste to pack machine to attach some micro components the PCB board. With the development of science and technology,SMT can also be applied to some large-size components.

　　The production process is as follows:
　 　•The PCB board positioning
　　 •Solder paste printing
　 　•Paste and pack
　 　•Return to the soldering stove
　　 •Finally inspection

DIP for Printed Circuit Board Assembly:

　　DIP stands for Dual Inline Package.Insert the componets to the PCB. It is used as a mean to integrate components cause the size is too large to paste and pack, or the manufacturer's production process cannot use SMT technology.At present, there are two ways to realize manual plug-in and robot plug-in.
　　The main production processes are as follows:
　　 •Paste back glue (to prevent tin plating to inappropriate places)
　　 •Plug-in
　　 •Inspection
　 　•Wave soldering
　　 •Brush plate (to remove the stain left in the process of passing the furnace)
　　 •Inspection

The Main Difference

　　SMT:SMT doesn’t need to drill holes on the PCB

　　DIP:It's nacessary to plug the pin of the component into the drilled hole.