Product Overview

Our High Resolution, High Volume, High Performance Large Printed Circuit Boards (PCBs) are meticulously engineered to address the needs of cutting-edge electronic applications that demand high precision, reliability, and superior performance.Optimized for high-volume production, these PCBs utilize advanced manufacturing techniques and premium materials to deliver consistent quality and outstanding durability.

Key Features:

- High Resolution: Advanced fabrication processes enable fine pitch components and detailed circuit patterns, ensuring precise signal routing and minimal signal loss.

- High Volume: Designed for large-scale manufacturing, our PCBs maintain consistent quality and performance throughout extensive production runs.

- High Performance: Engineered for robust performance in demanding applications, featuring excellent thermal management and electrical properties.

- Large Size Capability:Accommodates extensive and complex circuit designs, providing ample space for a wide range of electronic components.

 Custom Material

Selecting the right material is crucial for achieving the desired performance and reliability of your PCB. We offer a range of high-quality materials to ensure your specific needs are met.

1. FR-4:

   Standard FR-4: This is the most common material used for PCBs, offering a good balance of performance and cost. It is suitable for most general-purpose applications.

   High-Tg FR-4: Provides enhanced thermal stability for high-temperature applications, making it ideal for environments where heat resistance is critical.

2. Rogers:

   High-Frequency Laminates: Rogers materials are known for their low dielectric loss and high-frequency performance, making them perfect for RF and microwave applications.

3. Aluminum:

   Metal Core PCBs:Aluminum is used for its excellent heat dissipation properties. These PCBs are ideal for high-power applications where thermal management is crucial.

4. Polyimide:

   High-Temperature Resistance: Polyimide materials offer superior thermal stability and mechanical flexibility, suitable for applications exposed to high temperatures and harsh conditions.

5. Teflon (PTFE):

   Low Dielectric Constant: Teflon materials are used in high-frequency applications where low dielectric constant and low loss tangent are required.

6. Ceramic:

   High Thermal Conductivity:Ceramic PCBs offer excellent thermal conductivity and stability, making them ideal for high-power and high-frequency applications.

7. Custom Laminates:

   Tailored Solutions: We can provide custom laminates based on specific project requirements, ensuring optimal performance for your unique application.

Customization Options

Thickness:

   Standard: Common thicknesses include 1.6 mm, 2.0 mm, and 2.4 mm.

   Custom: Thickness can be tailored to meet specific design requirements.

Copper Weight:

   Standard: Available in 1 oz/ft² (35 µm) and 2 oz/ft² (70 µm).

   Heavy Copper: Options up to 20 oz/ft² (700 µm) for high current applications.

Surface Finishes:

   HASL (Hot Air Solder Leveling): Common finish for general applications.

   ENIG (Electroless Nickel/Immersion Gold): Provides excellent surface planarity and corrosion resistance.

   OSP (Organic Solderability Preservatives): Environmentally friendly option with good solderability.

   Immersion Silver/Tin: Alternative finishes offering good solderability and shelf life.

Solder Mask Colors:

   Standard Colors:Green, blue, black, white, red, yellow.

   Custom Colors: Available upon request for specific branding or aesthetic needs.

By offering a wide selection of materials and customization options, our High Resolution, High Volume, High Performance Large Printed Circuit Boards are tailored to meet the exact needs of your project, ensuring optimal performance and reliability. Contact us today to discuss your specific requirements and receive a personalized solution for your high-performance large PCB needs.