Copper clad laminates are important foundational materials for manufacturing printed circuit boards (PCBs) and are widely used in various electronic and communication devices. Copper clad laminates are composed of a substrate, copper foil, and adhesive. The copper foil and substrate are bonded together through the lamination process to form a circuit board material with good electrical performance and mechanical strength.

　　The substrate materials of copper-clad laminates usually include glass fiber reinforced epoxy resin board, polytetrafluoroethylene board, and other high-performance resin boards, which have good insulation and heat resistance. Copper foil is used as a conductive material to create circuit patterns. Adhesive is used to bond copper foil and substrate together, ensuring the mechanical strength and electrical performance of the circuit board.

　　The key performance indicators of copper-clad laminates include heat resistance, chemical resistance, dielectric constant, and mechanical strength. These indicators directly affect the reliability and service life of circuit boards. In order to meet different application requirements, copper clad laminates can also be stacked in multiple layers to form multi-layer circuit boards, further improving the integration and functional complexity of the circuit.