The detachment between the copper holes on the circuit board and the copper substrate, and even the continuity at the corners of the interface

　　Causing increased pollution of the neutralization tank by potassium permanganate, and poor water washing after removing the gel with potassium permanganate. Greatly reducing the service life and neutralization effect of the neutralization tank, resulting in residual potassium permanganate in the hole, affecting the subsequent copper deposition effect, causing some potential quality problems, poor copper deposition backlight, poor hole wall adhesion, no copper in the hole, hole wall detachment, blowing holes, bursting holes, etc; In addition, when the circuit board is more serious, excessive potassium permanganate will react with the neutralizing agent in the tank solution and produce a pale yellow substance, which will then adsorb onto the hole wall or inner copper ring, causing quality hazards such as poor inner layer connections, open circuits, rough holes, and plating current! In addition, due to the lack of drip time, if there are any defects in the process layout of the circuit board and the slot solution. It may cause cross contamination of the three types of tank fluids, which could lead to even more problems; Cannot be placed in potassium permanganate on the production line, and some semi-finished multi-layer boards of circuit boards are sometimes reworked by copper deposition. Another small groove should be used for rework, otherwise it may cause a large number of defective inner layer bonding and hole wall bonding in normal production boards; PCB circuit board

　　The problem is not with the quality of the medicine, but mainly with the process of removing adhesive residue itself. The sampling of circuit boards lies in the management and maintenance of production processes, as well as the operation of employees; Here is a brief analysis: there are issues with alkalinity and swelling; The temperature at which swelling occurs. The decrease in the activity strength of the tank solution caused by factors such as strength, time, or aging of the tank solution, or cross contamination of the tank solution due to poor process layout, etc;

　　It will cause difficulty and insufficient swelling of the adhesive residue during potassium permanganate oxidation. Possible incomplete removal of adhesive residue, resulting in poor inner layer connections, poor hole ratio bonding, and even circuit breakers on the circuit board; If the resin swelling cannot be fully removed by removing the adhesive, it will swell excessively. The resin at this location may experience pore wall detachment caused by concave pore walls;

　　The concentration of potassium permanganate is affected by the temperature of the potassium permanganate tank. The concentration of potassium permanganate, the concentration of sodium hydroxide, the temperature of the tank solution, the regeneration situation, the condition of manganese dioxide on the liquid surface of the circuit board, the load of the tank solution, the aging condition of the tank solution, and the control of the specific gravity of the tank solution are all aspects that need to be monitored and paid attention to, which may result in incomplete gel removal. The occurrence of any one or several of the above situations may lead to a decrease in the activity of the tank solution. PCB circuit board