Copper printed circuit boards, as an indispensable basic material in modern electronic industry, are widely used in various electronic and communication equipment. Copper printed circuit boards achieve electrical connections and functional implementation of electronic components by printing copper foil circuit patterns on the substrate.

　　The main materials of copper printed circuit boards include copper foil, substrate, and adhesive. Copper foil, as a conductive material, is used to make circuit patterns. The substrate serves as the support body and is usually made of glass fiber reinforced epoxy resin board, which has good insulation and heat resistance. Adhesive is used to bond copper foil and substrate together, ensuring the mechanical strength and electrical performance of the circuit board.

　　The key performance indicators of copper printed circuit boards include heat resistance, chemical resistance, dielectric constant, and mechanical strength. These indicators directly affect the reliability and service life of circuit boards. In order to meet different application requirements, copper printed circuit boards can also be stacked in multiple layers to form multi-layer circuit boards, further improving the integration and functional complexity of circuits.