2024-04-01
937
PCB halogen-free plate characteristics
1 Insulation of the material
Due to the use of P or N to replace the halogen atoms, the polarity of the molecular bond segment of the epoxy resin is reduced to a certain extent, so as to improve the insulation resistance and resistance to penetration.
2 Water absorption of the material
Because the N and P foxes in the nitrogen and phosphorus REDOX resin are less electron than the halogen, the probability of hydrogen bond formation with the hydrogen atom in water is lower than that of the halogen material, so the water absorption of the material is lower than that of the conventional halogen flame retardant material. For the plate, low water absorption has a certain impact on improving the reliability and stability of the material.
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