As the integration level of ICs increases, the number of IC pins also increases. However, the vertical tin spraying process is difficult to blow flat the fine solder pads, which brings difficulty to SMT mounting; In addition, the shelf life of tin spray boards is very short. And the gold-plated plate precisely solves these problems:

　　1. For surface mount technology, especially for 0603 and 0402 ultra small surface mount, the flatness of the solder pads directly affects the quality of the solder paste printing process and has a decisive impact on the quality of subsequent reflow soldering. Therefore, whole board gold plating is often seen in high-density and ultra small surface mount processes.

　　2. In the trial production stage, the influence of factors such as component procurement is often not that the board is soldered immediately upon arrival, but that it often has to wait for several weeks or even months before use. The shelf life of gold-plated boards is many times longer than that of lead-tin alloys, so everyone is willing to adopt them. Moreover, the cost of gold-plated PCBs in the sample stage is almost the same as that of lead-tin alloy boards.