BGA packaging has developed to be fully compatible with current soldering and assembly technologies. CSP or close pitch BGA have gate spacing of 0.5, 0.65, and 0.80mm, while plastic or ceramic BGA has relatively wider contact spacing (1.50, 1.27, and 1.0mm). BGA with coarse and dense spacing are less susceptible to damage than pin packaging ICs with dense spacing. The BGA standard allows for selective removal of contact points to meet specific I/O requirements. When establishing the contact point layout and pin distribution for BGA, the packaging developer must consider the chip design as well as the size and shape of the circuit chip (die). Another issue encountered when planning pin distribution is the orientation of the circuit chip. When suppliers use chip on board technology, they usually adopt a form where the circuit chip faces up. PCB sampling PCB board sampling PCB board sampling

　　The structure of circuit board prototype components is not specified in industry standards and guidelines. Each manufacturer will strive to make their specific structure meet customer defined applications. Depending on the physical properties of the material selected for manufacturing BGA, flip chip or wire bonding techniques may be used. Because the circuit chip attachment structure is a rigid material, the chip binding or attachment seat is usually located in the center, and the wires lead the signal from the chip strap pad to the arrangement matrix of spherical contact points.

　　The overall contour specifications of the array components allow for a lot of flexibility, such as pin spacing, contact matrix form, and structure. JEDEC MO-151 defines a large family of plastic BGA. The square profile includes a size range of 7.0~50.0mm and three contact point spacings: 1.50, 1.27, and 1.0 mm. Spherical contact points can be distributed in a unified form of even or odd sequence and row arrangement. Although the arrangement must maintain the symmetry of all packaging shapes, it is allowed to remove the position of contact points or a contact point in a certain area during component manufacturing