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Data analysis method for PCB aging testing
After conducting PCB aging testing, data analysis is an important step in evaluating PCB performance and reliability. Here are some commonly used data analysis methods:
1. Trend analysis:
Time series analysis: Arrange test data in chronological order, observe the trends of various indicators over time, and identify signs of aging.
Regression analysis: Use linear regression or nonlinear regression models to fit test data and predict the aging rate and lifespan of PCBs.
2. Statistical analysis:
Mean and standard deviation: Calculate the mean and standard deviation of test data to evaluate the stability and consistency of PCB performance.
Confidence interval: Calculate the confidence interval of test data to evaluate the credibility and reliability of the results.
3. Failure Mode Analysis:
Fault Tree Analysis (FTA): Construct a fault tree to analyze the causes and effects of various fault modes in PCB, and identify key fault points.
Failure Mode and Effects Analysis (FMEA): Evaluate the probability and impact of various failure modes, and develop preventive and improvement measures.
4. Analysis of lifespan model:
Weibull distribution analysis: Use Weibull distribution model to fit test data and evaluate the life distribution and reliability of PCB.
Bathtub Curve Analysis: Draw a bathtub curve of PCB failure rate over time to identify early failures, random failures, and wear and tear failure stages.
5. Multivariate analysis:
Principal Component Analysis (PCA): Extract the main components of test data, simplify the data structure, and identify the main aging factors.
Factor analysis: Analyze the correlation between various test data, identify potential aging factors and influencing mechanisms.
Through the above data analysis methods, the aging status and reliability of PCBs can be comprehensively evaluated, providing scientific basis for design optimization and quality improvement.
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