High frequency circuit board in the wiring design should pay attention to matters

　　1) Reasonable selection of the number of layers in the PCB design of the high-frequency circuit board wiring, the use of the middle inner layer plane as a power supply and ground layer, can play a shielding role, effectively reduce the parasitic inductance, shorten the length of the signal line, reduce the cross interference between signals, under normal circumstances, the four-layer board than the two-layer board noise is 20dB lower.

　　2) Wiring mode When wiring the high-frequency circuit board in the PCB design, the wiring must be turned in accordance with a 45° Angle, which can reduce the transmission of high-frequency signals and the coupling between each other.

　　3) Line length When routing high-frequency circuit boards in PCB design, the shorter the line length, the better, and the shorter the parallel distance between two lines, the better.

　　4) The number of holes in the PCB design of the high-frequency circuit board wiring, the fewer the number of holes, the better.

　　5) Interlayer routing direction When wiring a high-frequency circuit board in PCB design, the interlayer routing direction should be vertical, that is, the top layer is horizontal and the bottom layer is vertical, which can reduce the interference between signals.

　　6) Copper coating When wiring the high-frequency circuit board in PCB design, increasing the grounding copper coating can reduce the interference between signals.

　　7) Package in the PCB design of the high-frequency circuit board wiring, the important signal line for package processing, can significantly improve the anti-interference ability of the signal, of course, can also be the source of interference package processing, so that it can not interfere with other signals.