Introduction to aluminum substrate

　　First, the characteristics of LED aluminum substrate

　　1. Use external mount technology (SMT);

　　2. Extremely useful treatment of thermal diffusion in circuit design schemes;

　　3. Reduce the operating temperature of the commodity, improve the power density and reliability of the commodity, and extend the service life of the commodity;

　　4. Reduce the volume of goods, reduce the hardware and installation costs;

　　5. Replace the fragile ceramic substrate to achieve very good mechanical durability.

　　Second, the layout structure of LED aluminum substrate

　　Aluminum clad copper plate is a metal circuit board data, composed of copper foil, thermal insulation layer and metal substrate, its layout is divided into three layers:

　　Line layer: equivalent to the copper clad plate of the usual PCB, line copper foil thickness loz to 10oz.

　　Insulation layer: Insulation layer is a layer of low thermal resistance thermal insulation material.

　　BaseLayer substrate: A metal substrate, usually aluminum or optionally copper. Aluminum based copper clad plate and traditional epoxy glass cloth laminate and so on.

　　The circuit layer (that is, copper foil) usually constitutes a printed circuit by etching, so that the various parts of the component are connected to each other, usually, the circuit layer needs to have a great current carrying ability, and then a thicker copper foil should be used, the thickness is usually 35μm~280μm; The thermal insulation layer is the core skill of the aluminum substrate, which is usually composed of special polymers filled with special ceramics, low thermal resistance, excellent viscoelastic function, thermal aging resistance, and can accept mechanical and thermal stress.