In the process of PCB gold plating, what aspects and measures can we take to reduce the consumption of gold salts and achieve maximum product benefits?

　　The gold layer has characteristics such as corrosion resistance, high conductivity, good weldability, low and stable contact resistance, high temperature resistance, soft texture, and wear resistance. Meanwhile, after alloying with other metals such as carbon and iron, gold has higher hardness and better wear resistance. With the rise of market gold prices, the cost of gold plating has also become a key concern for enterprises.

　　The consumption of gold salt in electroplating gold wire mainly includes two aspects: the consumption of graphic gold layer on printed circuit board and the consumption of bath solution taken out. Excessive thickness of the gold plating layer or excessive amount of liquid carried out from the tank can lead to waste of gold salt and result in ineffective gold salt consumption costs. In addition, the current thickness of the gold-plated layer is mainly controlled by the production instructions and remarks, and there is almost no control over the upper limit of the gold-plated layer thickness.