Process flow of single-sided and double-sided multi-layer circuit board

　　1. The process flow of single-sided circuit board cutting and edge grinding → drilling → outer layer graphics → (full board gold plating) → etching → inspection → silk screen solder mask → (hot air leveling) → silk screen characters → shape processing → testing → inspection.

　　2. The process flow of double-sided circuit board tin spraying is as follows: cutting and grinding the edges → drilling → copper sinking and thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen solder mask → gold-plated plug → hot air leveling → silk screen characters → shape processing → testing → inspection.

　　3. The process flow of double-sided circuit board nickel plating and gold plating includes cutting and grinding edges, drilling holes, copper sinking and thickening, outer layer graphics, nickel plating and gold film etching, secondary drilling, inspection, silk screen solder mask, silk screen characters, shape processing, testing, and inspection.

　　4. The process flow of tin plate spraying includes cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → copper deposition thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen solder mask → gold-plated plug → hot air leveling → silk screen characters → shape processing → testing → inspection.

　　5. The process flow of multi-layer circuit board sinking nickel gold plate is as follows: cutting and grinding edges → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → laminating → drilling holes → copper sinking and thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen solder mask → chemical sinking nickel gold → silk screen character printing → shape processing → testing → inspection.