The most critical factor in maintaining PCB etching equipment is to ensure the high cleanliness and unobstructed nature of the nozzle, allowing it to spray smoothly. Blockages or slagging can create pressure during spraying, impacting the surface of the board. If the nozzle is not clean, it will cause uneven etching and result in the entire circuit board being scrapped.

　　Obviously, the maintenance of the equipment involves replacing damaged and worn parts, as the nozzle also has wear issues, so the replacement should include the nozzle. In addition, a more critical issue is to maintain the etching machine without slagging, as excessive accumulation of slagging often affects the chemical balance of the etching solution. Similarly, if there is a chemical imbalance in the etching solution, the situation of slagging will become more severe. When a large amount of slag suddenly appears in the etching solution, it is usually a signal indicating that there is a problem with the balance of the solution. In this case, strong hydrochloric acid should be used for appropriate cleaning or to supplement the solution.

　　In addition, residual film can also produce slagging substances. A very small amount of residual film dissolves in the etching solution, forming copper salt deposition. This indicates that the previous film removal process was not thorough, and poor film removal is often the result of the combination of edge film and electroplating.