Product Overview

Copper clad PCBs are characterized by a layer of copper that is laminated onto a non-conductive substrate, creating a reliable and efficient pathway for electrical signals.

Copper clad laminates come in various types and thicknesses, catering to different electronic applications, from simple consumer electronics to complex industrial machinery. The copper layer is crucial for conductivity, while the substrate, usually made of materials like FR-4, provides mechanical strength and insulation.

Key Features:

High Conductivity: Ensures efficient signal transmission and minimal energy loss.

Durability:Withstands thermal and mechanical stresses, making it suitable for various environments.

Versatility:Available in multiple thicknesses and materials to suit different needs.

Customization:Can be tailored to specific requirements for specialized applications.

Cost-Effective:Provides a balance between performance and cost, making it accessible for various projects.

Custom Specifications

We offer a wide range of customization options for copper clad PCB laminate printed circuit boards to meet the unique needs of your project. Here are the specifications you can customize:

1. Copper Thickness:

   Standard Thickness: 1 oz/ft² (35 µm), 2 oz/ft² (70 µm), 3 oz/ft² (105 µm)

   Custom Thickness: Available upon request for specific applications

2. Substrate Material:

   FR-4:Standard for most applications, offering a good balance of performance and cost

   High-Tg FR-4: Enhanced thermal stability for high-temperature applications

  Aluminum:For applications requiring superior heat dissipation

   Rogers:For high-frequency applications requiring low dielectric loss

3. Substrate Thickness:

  Standard Thickness: 1.6 mm, 0.8 mm

  Custom Thickness:Range from 0.2 mm to 3.2 mm, based on specific needs

4. Board Dimensions:

  Standard Sizes: 100 mm x 100 mm, 200 mm x 200 mm

  Custom Sizes: Tailored to fit the exact dimensions required for your project

5. Surface Finish:

   HASL (Hot Air Solder Leveling): Common finish for general applications

  ENIG (Electroless Nickel/Immersion Gold):Enhanced surface planarity and corrosion resistance

  OSP (Organic Solderability Preservatives):Environmentally friendly option with good solderability

6. Layer Count:

  Single-Sided: Suitable for simple circuits and low-cost applications

  Double-Sided:For more complex circuits requiring additional routing options

  Multi-Layer:For advanced circuits requiring high density and multiple signal layers

7. Thermal Management:

  Thermal Vias: Enhance heat dissipation for high-power applications

  Heat Sinks: Integrated or attached for superior thermal management

8. Electrical Properties:

  Dielectric Constant (Dk): Customizable for specific signal integrity requirements

  Dissipation Factor (Df): Low Df materials available for high-frequency applications

By providing these custom specifications, we ensure that your copper clad PCB laminate printed circuit boards meet the exact demands of your application, ensuring optimal performance and reliability. Contact us today to discuss your specific needs and get a quote for your custom PCB solution.