Copper clad circuit boards, as an indispensable basic material in modern electronic industry, are widely used in various electronic and communication equipment. Copper clad circuit board, as the name suggests, is a circuit board made by covering a layer of copper foil on the substrate and using a series of processes such as etching, drilling, and copper plating. It is not only the support for electronic components, but also the carrier for electrical connections of electronic components.

　　The main materials of copper-clad circuit boards include substrates, copper foil, and adhesives. The substrate is usually made of glass fiber reinforced epoxy resin board, which has good insulation and heat resistance. Copper foil is used as a conductive material to create circuit patterns. Adhesive is used to bond copper foil and substrate together, ensuring the mechanical strength and electrical performance of the circuit board.

　　The key performance indicators of copper-clad circuit boards include heat resistance, chemical resistance, dielectric constant, and mechanical strength. These indicators directly affect the reliability and service life of circuit boards. In order to meet different application requirements, copper clad circuit boards can also be stacked in multiple layers to form multi-layer circuit boards, further improving the integration and functional complexity of the circuit.