To solve the above problems of gilded boards, PCBs using gilded boards mainly have the following characteristics:

　　1. Due to the different crystal structures formed by depositing gold and gilding, the deposited gold will appear golden yellow and more yellow than gilding, resulting in better customer satisfaction.

　　2. Due to the different crystal structures formed by sinking gold and gold plating, sinking gold is easier to weld than gold plating, which will not cause poor welding and cause customer complaints.

　　3. Due to the fact that only nickel gold is present on the solder pad of the sinking gold plate, the signal transmission in the skin effect is not affected by the copper layer.

　　4. Due to the denser crystal structure of precipitated gold compared to gold plating, it is less prone to oxidation.

　　5. Due to the fact that only nickel gold is present on the solder pad of the sinking gold plate, it will not produce gold wire causing slight shortness.

　　6. Due to the fact that only nickel gold is present on the solder pad of the sinking gold plate, the bonding between the resistance welding and the copper layer on the circuit is more secure.

　　7. The engineering compensation will not affect the spacing.

　　8. Due to the different crystal structures formed by gold deposition and plating, the stress on the gold deposition plate is easier to control, which is more conducive to the processing of products with bonding. At the same time, it is precisely because sinking gold is softer than plating gold, that making gold fingers from sinking gold plates is not wear-resistant.

　　9. The flatness and shelf life of the gold plated plate are as good as those of the gold plated plate.