As the integration level of ICs increases, PCB sampling manufacturers also have more and more IC pins. The vertical tin spraying process makes it difficult to blow the fine solder pads flat, which brings difficulty to SMT installation; In addition, the shelf life of the tin spray board is very short. And the gilded plate precisely solves these problems: 1. For surface mount processes, especially for 0603 and 0402 ultra small surface mount processes, the flatness of the solder pad directly affects the quality of the solder paste printing process and plays a decisive role in the subsequent reflow welding quality. Therefore, whole plate gilding is often seen in high-density and ultra small surface mount processes. In the trial production stage, the influence of factors such as component procurement is often not that the board is welded immediately upon arrival, but rather that it often needs to wait for several weeks or even months before use. The shelf life of gold-plated boards is longer than that of lead-tin composite boards

　　Gold is many times longer, so everyone is willing to adopt it. Moreover, the cost of gold-plated PCBs in the sample stage is similar to that of lead-tin alloy plates.

　　But as the wiring becomes increasingly dense, the line width and spacing have reached 3-4 MIL. Therefore, there is a problem of short circuit in the gold wire:

　　As the frequency of the signal increases, the impact of skin effect on signal transmission in multiple coatings becomes more apparent:

　　The skin effect refers to the tendency of high-frequency alternating current to concentrate on the surface of a wire.

　　According to calculations, skin depth is related to frequency:

　　The other shortcomings of the gilded plate are listed in the table of differences between the gilded plate and the gilded plate.