The process of processing PCB multilayer boards is very complex, as it is in the process of laminated boards. The total thickness and number of layers of PCB multilayer boards are limited by the characteristics of the PCB board, and the variety of boards with different thicknesses that special boards can provide is generally limited. Therefore, designers must consider the characteristics of the board and the limitations of the PCB multilayer board processing technology in the PCB multilayer board design process

　　Processing PCB multi-layer board lamination refers to the process of bonding each layer of circuit board into a whole. The process includes: kiss pressing, full pressing, and cold pressing (to quickly cool the circuit board and maintain size stability). During the kiss pressing stage, resin infiltrates the bonding surface and fills the gaps in the circuit, and then enters full pressing to bond all the gaps.

　　The first thing to pay attention to when laminating PCB multilayer boards is that in design, the inner core board must meet the lamination requirements, mainly in terms of thickness, external dimensions, positioning holes, etc. It needs to be designed according to specific requirements. Overall, the inner core board requires no opening, short circuit, open circuit, no oxidation, and no residual film. In addition, the inner core board needs to be treated through processes such as black oxidation and browning. Oxidation treatment is the formation of a black oxide film on the inner copper foil, while browning treatment is the formation of an organic film on the inner copper foil.