processing method:

　　The processing process of PCB factory similar to epoxy resin/glass woven fabric (FR4), but the board is relatively crispy and easy to break the board. Drilling and gong knife life should be reduced by 20%during drilling and gongs.

　　2. PTFE (polytetrafluoroethylene) material

　　processing method:

　　1. Open ingredients: The protective film must be kept to prevent scratching and indentation

　　2. Drilling:

　　2.1 Use a new drilling (standard 130), the best one by one, the pressure of the feet is 40PSI

　　2.2 Aluminum sheet is a cover, and then use a 1mm mighty pad to step up the PTFE board

　　2.3 After drilling, use a wind gun to blow out the dust in the hole

　　2.4 Use the most stable drill, drilling parameters (basically the smaller the hole, the fast drill speed, the smaller the chip load, the smaller the return speed)

　　3. Pole treatment

　　3. Pole treatment

　　Plasma treatment or sodium cricket activation treatment is conducive to hole metalization

　　4. Pth Shen copper

　　4.1 After the micro erosion (the micro erosion rate is 20 micro -inch control), the PTH is pulled from the removing oil cylinder to enter the board

　　4.2 If necessary, the second PTH, just predict? The cylinder starts to enter the board