The original size of the copper-clad board is too large, making it inconvenient to process. Sometimes, it cannot even be placed in the printed circuit board processing equipment for processing. Therefore, it is necessary to first cut it into several copper-clad boards of different processing sizes. As for the specific size of the processing size, it needs to be determined based on the processing equipment for producing printed circuit boards, the size of each printed circuit board, and some process parameters. These process parameters not only include the length and width required for the printed circuit graphics themselves, but also the width consumed for fixing the screw holes on the printed circuit board to the electronic product frame, the process allowance for external processing, the clamping allowance for fixtures during chemical plating, electroplating, and corrosion, the positioning pin allowance for multi-layer printed circuit boards, the alignment mark allowance between layers, the mark allowance for printed circuit board manufacturers, and the edge width of printed circuit boards. Some recommended process parameters can be obtained from copper plating manufacturers or distributors. During the production and processing of printed circuit boards, the above data can be used to determine how many copper plates to cut a large original size copper plate into, whether to cut it vertically or horizontally, and whether it is possible to perform nesting, etc.