Since the mid -1980s in the mid -1980s, its output value and production have increased at a rate of more than 10 % (compared with the previous year). Because the components develop rapidly to `light, thin, short, small" " Multi -layer boards will be the most influential and vitality door category in the printing circuit board industry, and become the leading product. The multi -layer plate structure will move towards diversified and thin -level high -level, while the M C m one L structure will be faster faster. Development. Multi -layer board requires high device and technology investment. In the future, high -level multi -layer boards will be concentrated in strong PC B large manufacturers to develop and produce

　　High density

　　Thin, high (high) layered

　　Diversity of multi -layer plate structures

　　The thin substrate of the high -performance thin copper box

　　High flatness and surface coating technology of the board surface

　　Dead multi -layer board and rigidity multi -layer board