1. The thickness of gold is much thicker than that of gold plating, and sinking gold will produce a golden yellow color that is more yellow than plating, which is more satisfying for customers.

　　2. Compared to gold plating, sinking gold is easier to weld and will not cause welding defects, leading to customer complaints. The stress on the sinking gold plate is easier to control, which is more conducive to the processing of products with bonding. It is precisely because sinking gold is softer than plating gold that sinking gold plates make gold fingers less wear-resistant.

　　3. As long as there is nickel gold on the solder pad of the sinking gold plate, the signal transmission in the skin effect will not be affected by the copper layer.

　　4. Compared to gold plating, sinking gold has a denser crystal structure and is less prone to oxidation.

　　5. As the wiring becomes denser, the line width and spacing have now reached 3-4 MIL. Gold plating is prone to short circuits in the gold wire. As long as there is nickel gold on the solder pad, the sinking gold plate will not produce a short circuit of gold wire.

　　6. As long as there is nickel gold on the solder pad of the sinking gold plate, the bonding between the solder mask and the copper layer on the circuit is more robust. The engineering compensation will not affect the interval.

　　7. Generally used for boards with relatively high requirements and good flatness, sinking gold is generally chosen, and sinking gold generally does not present a black pad phenomenon after assembly. The flatness and service life of the gold-plated plate are as good as those of the gold-plated plate.