Aluminum substrate is a metal based copper clad plate with good heat dissipation function, commonly used for making LED lights. Let's now understand the difficulties and production specifications of the aluminum substrate production process.

　　1. Aluminum substrates are often used in power devices with high power density, so copper foil is relatively thick. If copper foil above 3oz is used, the etching process requires engineering design line width compensation.

　　2. The aluminum substrate surface of the aluminum substrate is protected with a protective film in advance during PCB processing, otherwise some chemicals may corrode the aluminum substrate surface and cause appearance damage.

　　3. The milling cutter used in the production of fiberglass board has a relatively low hardness and fast milling speed; The milling cutters used in the production of aluminum substrates have high hardness, and the milling cutter speed is at least two-thirds slower.

　　4. To produce fiberglass panels, only the heat dissipation system of the machine itself needs to be used for heat dissipation, but to process aluminum substrates, additional alcohol must be added to the gongs for heat dissipation.

　　5. Aluminum substrate manufacturers may encounter some difficulties in the production process of aluminum substrates, which are as follows:

　　(1) Using mechanical processing to produce aluminum substrates, there should be no burrs on the edges of the holes after drilling, otherwise it will affect the pressure test. The milling process of aluminum substrate is very difficult, and the stamping process requires the use of advanced molds. After the appearance is punched, the edges should be neat and free of burrs, and the solder mask layer on the board edge should not be damaged. Usually, a military mold is used, with holes punched from the circuit and the shape punched from the aluminum surface. After punching the shape, the board should have a warpage of less than 0.5%.

　　(2) During the entire production process of aluminum substrates, it is not allowed to scratch the aluminum substrate surface. Touching or using certain chemicals can cause surface discoloration or blackening, which is absolutely unacceptable. So one of the difficulties in producing aluminum substrates is to avoid bumping or touching the aluminum substrate throughout the entire process.

　　(3) When conducting high voltage testing on the aluminum substrate, the communication power supply aluminum substrate requires 100% high voltage testing. Dirt, holes, burrs on the aluminum substrate edge, line serrations, or any small damage to the insulation layer on the board surface can cause fire, leakage, and breakdown during the high voltage resistance test. Resulting in delamination and blistering of the pressure test board, all were rejected.