As the speed of integrated circuit output switches increases and the density of PCB boards increases, Signal Integrity has become one of the essential issues in high-speed digital PCB design. Factors such as the parameters of components and PCB boards, the layout of components on the PCB board, and the layout of high-speed signal lines can all cause signal integrity issues.

　　For PCB layout, signal integrity requires providing a circuit board layout that does not affect signal timing or voltage, while for circuit wiring, signal integrity requires providing termination components, layout strategies, and wiring information.

　　High signal speed, incorrect layout of termination components, or incorrect wiring of high-speed signals on a PCB can all cause signal integrity issues, which may result in incorrect system output, abnormal circuit operation, or even complete failure. How to fully consider signal integrity factors and take effective control measures in the PCB design process has become a hot topic in the PCB design industry today.

　　Good signal integrity refers to the ability of a signal to respond with the correct timing and voltage level values when needed. On the contrary, when the signal cannot respond properly, there is a problem with signal integrity.

　　Signal integrity issues can lead to or directly lead to signal distortion, timing errors, incorrect data, address and control lines, as well as system malfunctions, and even system crashes. Signal integrity issues are not caused by a single factor, but by a combination of multiple factors in board level design.

　　The switching speed of the IC, incorrect layout of termination components, or incorrect wiring of high-speed signals can all cause signal integrity issues. The main signal integrity issues include delay, reflection, synchronous switching noise, oscillation, ground bounce, crosstalk, etc.