1. Process flow

　　The main process flow of SMT mounting includes printing, mounting, and soldering, and each step needs to be strictly executed according to the process. Due to the significant impact of SMT mounting on circuit stability and reliability, more attention needs to be paid to quality control and technical difficulties in the production process.

　　2. Technical points

　　In the process of SMT mounting, there are several technical points that need special attention:

　　(1) Selection and use of glue. During the installation process, it is necessary to select appropriate glue to ensure that the components can be pasted onto the PCB board, and also pay attention to the amount of glue used to avoid affecting the heat dissipation of the components.

　　(2) Selection and use of solder paste. During the installation process, it is necessary to select appropriate solder paste to ensure welding quality, while also paying attention to the amount of solder paste used to avoid affecting the welding effect.

　　(3) Control of reflow temperature. During the welding process, it is necessary to strictly control the welding temperature to ensure the reliability and consistency of the welding.