Blind hole embedding: The functionality of 5G products has been improved, and the demand for high-density PCB circuit boards has increased. There is an increasing demand for multi-stage HDI products and even products that are interconnected in any order. Currently, most PCB factories have a trend towards mature 1-3 level HDI, but higher level blind hole embedding capabilities need to be improved

　　Stub: The short pile effect of 112G products cannot be ignored, and the back drilling stubs have put forward stricter requirements, and ostub will be the trend

　　Copper embedding: Heat dissipation requirements for 5G communication high-frequency high-power devices. Copper blocks are embedded inside the PCB to enhance its heat dissipation capability