Key components require preset test points on the PCB circuit board. The solder pads used for welding appearance assembly components are not allowed to be used as inspection points. A dedicated test solder pad must be pre-set to ensure smooth solder joint inspection and production debugging. The solder pads used for testing should be arranged on the unified side of the PCB circuit board as much as possible, which is beneficial for testing and reduces the cost of testing. The following circuit board sample manufacturer will tell you its process preset requirements:

　　(1) The distance between test points and the edge of the PCB circuit board should be greater than 5mm;

　　(2) The test point should not be covered by solder mask or text ink;

　　(3) The testing point should be preferably coated with solder or selected with a soft, easy to penetrate, and non oxidizing metal to ensure reliable grounding and extend the service life of the probe

　　(4) The testing point should be placed 1mm away from the component to prevent the probe from colliding with the component;

　　(5) The test points need to be placed in the positioning hole (used in conjunction with the test points for positioning, preferably non-metallic holes, with positioning hole errors within ± 0.05mm), 3.2mm outside the circular circumference;

　　(6) The diameter of the test points shall not be less than 0.4mm, and the distance between adjacent test points shall fortunately be more than 2.54mm, but not less than 1.27mm;

　　(7) Components with a height exceeding 6.4mm cannot be placed on the testing surface, as excessively high components will cause poor contact between the online testing fixture probe and the testing point;

　　The distance C between the middle of the test point and the edge of the chip component is related to the SMD height H as follows: SMD height H ≤ 3mm, C ≥ 2mm; SMD height H ≥ 3mm, C ≥ 4mm.

　　(9) The size, spacing, and layout of the test spot welding plate should also match the relevant requirements of the testing equipment used.