The copper foil substrate is cut into size suitable for processing production. Before the substrate is compressed, it is usually necessary to use brushing, micro -erosion and other methods to properly crudely treat the plate surface of copper foil, and then attach the dry membrane light to the top with appropriate temperature and pressure. Send the substrate with the dry membrane light resistance into the ultraviolet exposure machine to expose. After the light resistance is illuminated by ultraviolet rays in the negative light, it will generate a polymerization reaction (the dry membranes of the area will be in the subsequent development and the copper steps of copper will be will be will be will be will be being being exposed. Keep it as a etching resistant), and move the line image on the negatives to the obstruction of the dry membrane of the plate. After tearing off the protective film on the membrane surface, first use sodium carbonate aquatic solution to remove the zone that is not subject to light on the membrane surface, and then use the hydrochloride and hydrogen peroxide to corrode the exposed copper foil to form a line. Finally, the sodium hydroxide water solution was washed away from the dry membrane light resistance. For the inner line board of the six -layer (inclusive) or more, the riveting benchmark hole of the line -pairing of the layer line is automatically located. Multi-layer boards

　　In order to increase the area that can be wiring, multi -layer boards are used with more single or double -sided wiring boards. Multi -layer panels use several double panels, and put a layer of insulating layer (pressing) between each layer of insulating layer.