A printed board is better when installed upright, and the distance between boards should generally not be less than 2cm. Moreover, the arrangement of devices on the printed board should follow certain rules:

　　For equipment that uses free convection air cooling, it is better to arrange integrated circuits (or other devices) in a longitudinal manner;

　　For equipment that uses forced air cooling, it is better to arrange integrated circuits (or other devices) in a horizontal and elongated manner;

　　Devices on the same printed circuit board should be arranged in zones according to their heat generation and heat dissipation degree as much as possible. Devices with low heat generation or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed upstream (at the inlet) of the cooling airflow, while devices with high heat generation or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) should be placed downstream of the cooling airflow;

　　In the horizontal direction, high-power devices should be arranged as close as possible to the edge of the printed circuit board to shorten the heat transfer path;

　　In the vertical direction, high-power devices should be arranged as close as possible to the top of the printed circuit board to reduce the impact of these devices on the temperature of other devices during operation;

　　Devices that are sensitive to temperature are better placed in areas with lower temperatures (such as the bottom of the device). Do not place them directly above the heating device. Multiple devices are better placed in a staggered layout on a horizontal plane.