The current trend of electronic products, in a small component or whole machine, constantly integrates more and more devices and functions. Hybrid integration technology has become one of the key technologies that increase the packaging density of source and passive devices.

　　In the mixed integration of various manufacturing steps, the device and the circuit are interconnected, some passive devices such as resistors, such as resistors, are directly made of thick film or film process on the substrate. There are many important parameters of the design of the layout of the mixed integrated circuit board; the width of the wires, the routing of the wire and the keyboard, the height of the bonding coincidence, the height of the bonding leader, and the heat consumption must be considered.

　　The thick -membrane integrated circuit process, the interconnection between the device and the circuit, the wires and resistors are on the substrate, and the various functional pulp is printed and sintered. The thin -film integrated circuit process, the interconnection and wire use the electroplating or other PVD methods, it is deposited on the ceramic substrate. The electrophoresis graphics required for the photocardial production, and the resistance can be printed or welded with other passive devices. After the installation of non -passive meter and stickers on the substrate is completed, the chip paste device pastes the circuit chip to the given position of the substrate, and then use the key to use the key to make the key combination of gold or aluminum wire to achieve the chip and the substrate circuit circuit. The electrical connection between the room is finally encapsulated.

　　Hybrid integration technology can integrate a large number of circuit chips and small passive devices on a very small substrate area. If the standard SMT surface installation process is adopted, it is necessary to occupy a area of up to 20 times that the hybrid integration technology is.

　　The manufacturing process of hybrid integration circuit needs to be comprehensively grasped by the semiconductor wafer manufacturing process, as well as the chip assembly and key combination process. Some small companies do not have these conditions, and small batches of mixed circuit components are relatively expensive. However, the application of hybrid integrated circuits involves medical care, aerospace, military, automotive and communication fields. In these fields, hybrid integrated circuit technology is indispensable.