At present, the formation process of refined circuits includes laser imaging (pattern transfer) and pattern etching forming.

　　Laser direct imaging (LDI) technology is the process of obtaining refined circuit patterns directly by laser scanning on the surface of copper clad plates coated with photoresist. Laser imaging technology greatly simplifies the process flow and has become the mainstream technology in HDI PCB plate making.

　　The application of semi additive method (SAP) and improved semi additive method (mSAP), namely graphic etching method, is increasing nowadays. This technology process can also achieve conductive circuits with a line width of 5um.

　　How to improve electroplating uniformity and deep hole plating ability in PCB manufacturing, and improve the reliability of the board. This depends on the continuous improvement of the electroplating process, starting from various aspects such as the proportion of electroplating solution, equipment allocation, and operating procedures.

　　The ability of high-frequency sound waves to accelerate etching; Permanganate solution can enhance the ability of workpiece decontamination, and high-frequency sound waves will stir and add a certain proportion of potassium permanganate electroplating solution in the electroplating tank. This helps the plating solution to flow evenly into the hole. Thus improving the deposition ability and uniformity of electroplating copper.

　　At present, the copper plating and filling of blind holes are also mature, and can be used for copper filling of through holes with different apertures. The two-step copper plating hole filling method is suitable for through-holes with different pore sizes and high thickness to diameter ratios, with strong copper filling ability and the ability to minimize the thickness of the surface copper layer.