Copper clad panels were truly adopted on a large scale in PCB production, first appearing in the US PCB industry in 1947. The PCB substrate material industry has also entered its early stage of development. During this stage, the manufacturing technology progress of the raw materials used in the manufacturing of substrate materials - organic resins, reinforcing materials, copper foil, etc. - provides a strong driving force for the development of the substrate material industry. As a result, the manufacturing technology of substrate materials is gradually maturing.

　　The invention and application of integrated circuits, as well as the miniaturization and high-performance of electronic products, have pushed PCB substrate material technology onto the track of high-performance development. The rapid expansion of demand for PCB products in the world market has led to rapid development in the production, variety, and technology of PCB substrate materials. At this stage, a broad new field of substrate material application has emerged - multi-layer printed circuit boards. At the same time, at this stage, the substrate material has further developed its diversity in structural composition.

　　In the late 1980s, portable electronic products represented by laptops, mobile phones, and small cameras integrated with video recording began to enter the market. These electronic products are rapidly developing towards miniaturization, lightweight, and multifunctional, greatly promoting the progress of PCBs towards micro pores and micro wires. Under the changing demand in the PCB market mentioned above, a new generation of multilayer boards, called Build-up Multilayer Boards (BUMs), which can achieve high-density wiring, was introduced in the 1990s. The breakthrough in this important technology has also led the substrate material industry into a new stage of development dominated by substrate materials for high-density interconnect (HDI) multilayer boards. In this new stage, traditional copper clad panel technology is facing new challenges. PCB substrate materials have undergone new changes and creations in terms of manufacturing materials, production varieties, substrate structure, performance characteristics, and product functions.