1. Process flow

　　The main process of PCB board production includes graphic design, circuit layout, copper foil coverage, photolithography, etching, drilling, metallization, tin spraying, and organic copper clad board. Each step needs to be strictly executed according to the process. Due to the crucial role played by PCB board production throughout the entire process, great attention should be paid to all production processes.

　　2. Technical points

　　In the process of PCB board production, there are several technical points that need special attention:

　　(1) Circuit layout. Circuit layout is the foundation of the entire circuit design and one of the key factors determining circuit performance. For high-frequency circuits, attention should be paid to impedance matching and signal interference during the circuit layout process.

　　(2) Photolithography photography. Photolithography refers to the process of amplifying a graphic circuit onto a PCB board through a certain method for comprehensive exposure. In the process of photolithography, it is necessary to pay attention to the accurate control of exposure time to ensure clear and visible graphic lines.

　　(3) Etching. Etching is the process of etching off unwanted parts of a PCB board through chemical liquids. During the etching process, it is necessary to strictly control the concentration and temperature of the etching solution to ensure that the graphic circuits on the PCB board can be clearly visible.