There are certain technical requirements for the rate of copper deposition when using a chemical copper plating solution. If the speed is too slow, it may cause voids or pinholes in the hole wall; If the copper deposition rate is too fast, it will result in rough coating. Therefore, scientific determination of copper deposition rate is one of the means to control the quality of copper deposition. Taking the example of the chemical plating of thin copper provided by Xianling, briefly introduce the method for measuring the copper deposition rate:

　　(1) Material: Using epoxy substrate after copper etching, with a size of 100 x 100 (mm).

　　(2) Measurement steps: A. Bake the sample at 120-140 ℃ for 1 hour, and then weigh W1 (g) using an analytical balance; B. Corrosion in a mixture of 350-370 grams/liter of chromic anhydride and 208-228 milliliters/liter of sulfuric acid (at a temperature of 65 ℃) for 10 minutes, then rinse with clean water; C. Treat the waste liquid from chromium removal (at a temperature of 30-40 ℃) for 3-5 minutes and wash thoroughly; D. Pre immerse, activate, and treat in the reducing solution according to the process conditions; E. Sediment copper in a copper plating solution (temperature 25 ℃) for half an hour and clean thoroughly; F. The test piece is dried at 120-140 ℃ for 1 hour until constant weight is reached, and W2 (g) is weighed.

　　(3) Calculation of copper deposition rate: Rate=(W2-W1) 104/8.93 × 10 × 10 × 0.5 × 2( μ M)

　　(4) Comparison and judgment: Compare and judge the measurement results with the data provided by the process information.