Recently we have produced a new semiconductor board,we would like to share some pictures of our new product as below:

 The character of this new product as below:

1.12 layers with heavy copper 4oz for all layers;  

2.The board thickness is 6.35mm; 

3.The finishing is ENIG(Au:2u”) + Selectivity hard gold plating (Au:50u”); 

4.This board with countersunk and blind routing design; 

5.With Via-in-pad design, 

6.The aspect ratio is 16:1