1) Single panel process flow

　　Cutting and grinding → drilling → outer layer graphics → (full plate gold plating) → etching → inspection → silk screen welding resistance → (hot air leveling) → silk screen characters → contour processing → testing → inspection

　　2) Process flow of double-sided tin spraying board

　　Cutting and grinding → drilling → copper sinking and thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen resistance welding → gold-plated plug → hot air leveling → silk screen characters → external processing → testing → inspection

　　3) Process flow of nickel gold plating on double-sided boards

　　Cutting and grinding → drilling → copper sinking and thickening → outer layer graphics → nickel plating, gold film removal and etching → secondary drilling → inspection → silk screen resistance welding → silk screen characters → external processing → testing → inspection

　　4) Process flow of multi-layer tin spraying board

　　Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → copper sinking and thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen resistance welding → gold-plated plug → hot air leveling → silk screen characters → external processing → testing → inspection

　　5) Process flow of nickel gold plating on multi-layer boards

　　Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → copper deposition and thickening → outer layer graphics → gold plating and film removal etching → secondary drilling → inspection → silk screen resistance welding → silk screen characters → external processing → testing → inspection