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  • How to solve PCB board warping

    2023-06-27

    346

      

      1. Engineering design: The arrangement of interlayer semi cured sheets should correspond;

      Multi layer core boards and semi cured sheets should use the same supplier's products;

      The outer C/S surface graphics area should be as close as possible, and independent grids can be used;

      2. Drying board before cutting

      Generally, at 150 degrees Celsius for 6-10 hours, the moisture inside the board is removed, further allowing the resin to cure completely and eliminating stress inside the board; Drying the board before opening, both the inner layer and both sides are required!

      3. Before laminating the multi-layer board, attention should be paid to the longitudinal and latitudinal directions of the cured sheet:

      The shrinkage ratio in the warp and weft directions is different, so pay attention to distinguishing the warp and weft directions before cutting and stacking the semi cured sheet; When cutting the core board, attention should also be paid to the warp and weft directions; The general direction of the cured sheet roll is in the warp direction; The length direction of the copper clad plate is meridional;

      4. After laminating the thick stress relieving pressure plate, cold press and trim the rough edges;

      5. Drying plate before drilling: 150 ° C for 4 hours;

      6. It is recommended to use chemical cleaning instead of mechanical grinding and brushing for thin plates; Special fixtures are used during electroplating to prevent bending and folding of the board;

      7. After tin spraying, cool naturally on a flat marble or steel plate to room temperature or air float bed for cooling before cleaning;

      Warping plate treatment:

      150 degrees Celsius or hot pressing for 3-6 hours, using a flat and smooth steel plate for heavy pressing, 2-3 times baking.

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