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  • How to prevent circuit board warping?Standard PCB Layout and Design Services

    2023-06-07

    500

      Impendacne Control PCB Factory

      1. Engineering Design

      The arrangement of interlayer semi cured sheets should correspond; Multi layer core boards and semi cured sheets should use the same supplier's products; The outer C/S surface graphics area should be as close as possible, and independent grids can be used;

      2. Drying board before cutting

      Generally, at 150 degrees Celsius for 6-10 hours, the moisture inside the board is removed, further allowing the resin to cure completely and eliminating stress inside the board; Drying the board before opening, both the inner layer and both sides are required!

      3. Attention should be paid to the warp and weft directions of the cured sheet before laminating the multi-layer board

      The shrinkage ratio in the warp and weft directions is different, so pay attention to distinguishing the warp and weft directions before cutting and stacking the semi cured sheet; When cutting the core board, attention should also be paid to the warp and weft directions; The general direction of the cured sheet roll is in the warp direction; The length direction of the copper clad plate is meridional;

      4. Stress relief after lamination, cold pressing after pressing plate, trimming rough edges;

      5. Drying plate before drilling: 150 ° C for 4 hours;

      6. It is recommended to use chemical cleaning instead of mechanical grinding and brushing for thin plates; Special fixtures are used during electroplating to prevent bending and folding of the board

      7. After tin spraying, put it on a flat marble or steel plate and Free cooling to room temperature or clean it after cooling in an air floating bed;

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