The trend research on PCB sampling technology began to be implemented at the end of 2011, including English and Chinese versions. 41 PCB sample manufacturing companies participated in the survey, including dominant companies from Asia, Europe, and North America. They hold a 16.5% share of the global PCB market. The IPC research sample is representative of the global industry in terms of company size and product portfolio.

　　Among the companies studying the trend of PCB sampling technology, the production of high-density interconnect (HDI) boards is expected to increase by 26% between 2011 and 2014. Stacking and interleaving micropores technology will also be widely used, thereby affecting the performance of any layer of micropores and any through-hole. With trends driven by miniaturization and high-speed technology, surveys have shown that the two most common factors limiting circuit scale miniaturization are solder mask pattern alignment and assembly.

　　Most companies are evaluating new surface processing methods, especially the nickel plating palladium plating gold plating membrane system (ENIPIG). The report proves that the high price of gold has a certain impact on the changes in PCB board sampling processing, and about a quarter of survey participants attempt to use alternative metals. 17% of respondents attempted to reduce the thickness of gold, including companies that claimed that the price of gold had no impact on their material choices.

　　Among the two main substrates currently used, multifunctional epoxy resin is expected to be used in over half of the circuit board production field by 2014, while the use of glass fiber will decrease. The current substrate usage data and predictions for 2014 indicate that the substrate is moving towards high-temperature thermal performance, which also indicates the use of more low loss materials. By 2014, the production of hybrid printed boards or modules, as well as the use of printed electronics and optical technologies in printed board production, will significantly increase.